By UMC
UMC also works with world leading packaging houses to provide silicon proven packaging solutions. Starting from test-chip and technology development with assembly support through its packaging partners, the silicon proven packaging solutions can meet the requirements of demanding designs, meet stringent qualification criteria, and ensure reliability for sophisticated chips such as those utilizing ultra low-K and low-K dielectric materials for Cu interconnect. All vendors are IATF16949 certified and must meet UMC set criteria regarding yields and cycle time.
