By EV Group
EV GROUP® | Products // Temporary Bonding and Debonding Systems Bonding and Debonding Solutions for Temporary Introduction Temporary bonding is an essential process that offers mechanical support for thin or to-be-thinned wafers, which is important for 3D ICs, power devices and FoWLP wafers as well as for handling fragile substrates, like compound semiconductors. EVG’s outstanding bonding know-how is also evident in its temporary bonding and debonding equipment, which it has provided since 2001. Temporary Bonding and Debonding Benefits Adaptiveness - Open adhesive platform - Modular tool layout – throughput optimized depending on specific process - Product range from manual to fully automated tools Handling - Bridge capability for different substrate sizes - Available with multiple load port options and combinations Control - Integrated metrology enables feedback loop for high-yield processes in automated tools - Integrated software for real-time monitoring and recording of all relevant process parameters - Fully integrated SECS/GEM interface in automated tools EV GROUP® | Products // Bonding // Temporary Bonding and Debonding Systems Carrier wafer coated with release layer Front side processed device wafer Flip wafer Alignment Bond process Temporary Bonding Principle Debonding Principle Mount wafer stack onto film frame Debond process Clean process Thin wafer on film frame Wafer thinning & Backside processing EVG®850 DB Automated Debonding System - Reliable handling of thinned, bowed and warped wafers with and without topography - Automated cleaning of debonded wafer - Available with multiple load port options and combinations - Software monitoring of processes parameters - Bridge tool capability for different substrate sizes - Substrate ID reader and SECS/GEM integration - Modular tool layout – throughput-optimized depending on specific process EVG®850 TB Automated Temporary Bonding System - Open adhesive platform - Various carriers possible (silicon, glass, sapphire, etc.) - Software monitoring of processes parameters - Bridge tool capability for different substrate sizes - Substrate ID reader and SECS/GEM integration - Integrated inline metrology module for automated feedback loop - Modular tool layout – throughput-optimized depending on specific process EVG®880 LayerRelease™ - Fully automated, front end compatible HVM equipment - Substrate size up to 300 mm (SEMI M1) - Substrate ID reader and SECS/GEM integration - OHT, AGV, PGV compatible - Complete process control including laser metrology at point of use - Integrated Separation Module for lift off of exposed substrates EVG®805 Debonding System - Thermal slide off or thermal lift off debond configuration - Recipe-controlled system - Real time monitoring and recording of process parameters - Automated thickness control - Unique features for thin-wafer handling - Various chuck designs to support thinned, bowed and warped wafers with and without sensitive topography EVG Process Expertise Wafer & Template Fabrication Substrate Bonding for SOI Alignment Verification Resist Coating Spin/Spray Nano-imprint Lithography Thinning, CMP Electro-plating RIE, DRIE Wafer Dicing...etc. Bond Alignment Resist Developing Temporary Bonding/ Debonding CVD, LPCVD, PVD,... Wet Etching Stress Relief Etching Wafer Bonding Metallization Resist Lift-Off Oxidation Chip-to-Wafer Bonding Wafer Bumping & Redistri-bution Substrate Cleaning Plasma Activation Proximity Lithography Maskless Exposure Metrology EVG Processes Software and Support The customized machine software EVG CIMFramework offers a variety of features that optimize your production processes and increase efficiency. The user-friendly interface allows for quick familiarization. Specifically, the intuitive recipe functionality simplifies the configuration of machine operations and process steps. The software is Microsoft® Windows based and seamlessly communicates via SECS/GEM with the factory hosts. It enables smooth and secure data exchange and integration into the existing infrastructure. Our experienced support team is here to assist you with any questions or issues including field-proven, real-time remote diagnostics via secured connection. Cleanroom space on three different continents (Europe – HQ, Asia – Japan, North America – USA) and a de-centralized worldwide support structure underline this. In addition, our new innovative data analysis platform EVG Analytics enables you to intelligently analyze your machine data and gain valuable insights. Whether you want to perform time series analyses, process quality assessments or application-specific analyses - our product provides you with the tools to use your machine data efficiently. EVG Debonding Capabilities Slide-Off and Lift-Off Debonding UV Laser Debonding IR Laser Debonding - Thermal debonding - Temperature triggered softening or outgassing of adhesive - Single-layer thermoplastic adhesive systems - Invariant to device wafer topography and material - Invariant to carrier wafer material - Debonding temperature linked to thermal stability - EVG LowTemp TM debonding - UV laser release enabling force-free carrier lift-off - Single- or dual-layer adhesive system (thermo-plast, thermoset, photoset and b-stage adhesives) - Independent of device wafer type and surface - UV transparent carrier - EVG LowTemp TM debonding - IR laser release enabling force-free carrier lift-off - Inorganic release layer (nanometer scale thickness) - Temperature stable for BEOL & FEOL - Carrier has to be silicon - Front-end-of-line compatible HEAT UV LIGHT IR LIGHT EV GROUP® | Products // Bonding // Temporary Bonding and Debonding Systems Modules for temporary bonding Spin Coat Module - With up to two free configurable dispense arms per module. - Automated nozzle wash, EBR and BSR. Stacked Bake Modules - With fixed proximity pins, recipe controlled temperature and time. - Optional solvent bakes with double-side heating and high temperature bakes up to 350 °C. Bond Module - With automatic, low-force wedge error compensation and integrated alignment within bond chamber. - Dedicated bond module for UV initiated adhesive bond available. Inline Metrology Module - Contactless and non-destructive 100% production inspection. - Metrology Capabilities: Thickness and TTV of IR transparent layer and stacks, topography, bow and warp. Modules for debonding UV Laser Debond Module - High-throughput, room-temperature debonding through glass carrier. - Complete process monitoring and control. IR Laser Release Module - High-throughput, room temperature exposure through silicon carrier. - Front-end-of-line compatible. - Complete process monitoring and control. Separation Module - Force controlled lift off of carrier wafer after IR Laser release. Slide off Debond Module - Fully supported thin wafer during thermal initiated horizontal slide off process. - Complete process monitoring and control. Clean Module - Capable of handling film frame mounted, thin or high-topography wafers. Detape Module - Removing temporary bonding adhesives by peeling it with an adhesive tape. Film Frame Mount Module - Lamination of thin wafers or wafer stacks on film frames using pre-cutted tapes.
