By Loadpoint
Applications Photonics – dicing to singulate optical components such as LEDs, photodiodes and photosensors Optics – Optic fibre and associated component cutting, optical lenses and windows Glass – cutting of encoders, glass scales, chrome masks Process targets Dicing: Process and blade optimisation to ensure the highest productivity and lowest cost without sacrificing cut quality, optimisation of work holding materials & chucks to minimise top and bottom surface chipping, protection of special optical coatings & masks whilst dicing, verticality of cuts, maintaining precision for angled cuts. Post-dice cleaning & handling: Ensuring the materials are free of contamination from dicing tapes & wax, developing the best cleaning process to maximise productivity and cleanliness, protecting the materials whilst cleaning, developing systems and packaging to guarantee protection during the next work process or off-site transportation. Options There are two options for you to pursue photonics, optics and glass dicing. Firstly, Loadpoint manufacture a number of machine systems so you can perform the work at your premises. Secondly, Loadpoint offer a dicing solutions whereby you send us your material and specifications and we will dice and return the work for you. Loadpoint dicing solutions Loadpoint dicing solutions dicing facility for dicing, cutting, drilling, grinding and prototyping
