The entire process of MOE production, from design, prototyping, assembling, and mass production is done internally. Mass production is done by NIL, which, unlike semiconductor processes, imposes no restrictions on meta-atom geometries like size, shape, and location. This ensures best-performing MOEs based on current design techniques and greater freedom to innovate. Moreover, NIL enables NILT to mass produce without being dependent on capital-intensive equipment and low availability of DUV lithography equipment. Prototyping is secured by e-beam lithography (EBL) and mass production by nanoimprint lithography (NIL). This enables us to rapidly prototype MOEs and scale to mass production faster than anyone else.
