By UMC
Diversified Packaging Solutions for IoT, Automotive Applications Experienced Wire Bond, Bump, Stacked Die, WLP Turnkey Service Qualified 2.5D, 3DIC, FO Solutions for Advanced Package Demand Packaging solutions offered: 3DIC / 2.5D TSI; Wire Bond (QFP / LQFP, QFN, TFBGA, LGA); Flip Chip (FCBGA, HS-FCBGA); WLP FO-WLP (WLP, Panel PoP, FO-WLP); PoP FO-PoP (PoP, FO-PoP); SiP / MCP (Stack Die TFBGA, Stack Die QFP, Stack Die QFN)
