By Loadpoint
Applications Dicing to singulate MEMS structures on wafers and ceramics, high precision cutting and drilling of materials to produce MEMS components. Process targets Developing the best techniques to dice multi-layer and multi-material structures, avoiding damage to sensitive surface topography and coatings, protection of delicate MEMS structures and bonding pads, minimising energy dissipation within the structures. Options There are two options for you to pursue MEMS dicing and processing. Firstly, Loadpoint manufacture a number of machine systems so you can perform the work at your premises. Secondly, Loadpoint offer dicing solutions whereby you send us your material and specifications and we will dice and return the work for you. Loadpoint dicing solutions Loadpoint dicing solutions facility for dicing, cutting, drilling, grinding and prototyping
