Quickly and efficiently analyze flatness, warp, bow and other critical parameters of your products. Either manually with ScanCT or fully automated using ASCAN. Warp & Bow Flatness Angle Thermal Warpage & Stress Warp & Bow: Our systems provide high-resolution measurement and analysis of warp and bow, ensuring compliance with standards such as SEMI – supported by three-point alignment or customized interfaces. Flatness: Measure the flatness of your products with high-accuracy. Scan an entire part or multiple parts at once for individual or combined analysis. Angle measurement: Perform precise angle measurements in both 2D and 3D. Need to measure an angle relative to a specific area? Simply place a reference cursor on the desired area and the analysis will automatically adjust to it. Thermal Warpage & Stress: Our metrology systems with heating provide a heating plate or convection chamber for high-resolution thermal warpage and stress measurements. Define precise heating and cooling cycles, measure warpage and thermal stress at specified temperatures.
