By Wintech Nano-Technology Services Pte. Ltd.
Project definition: special packaging, multiple corrosion with chemical agents or increased laser opening, etc.; Sample AI Pad special handling can be retained, and the chip can be taken out for front/back FA; Application advantages: formal assembly, flip packaging, mold assembly chips can be taken out; The pads of the chip can be retained, and they are happy to take out Si silicon III-V optoelectronic chips.
