By Soitec
Thanks to the patented Smart Cut™ technology, Soitec designs substrates that are specifically tailored to meet customer expectations. For instance, a thin crystalline material layer can be transferred from a piezoelectric donor substrate (LTO, LNO), Silicon Carbide (SiC), Gallium Nitride (GaN or InGaN), or Indium Phosphide (InP) to another substrate, enabling the production of high-value plates at a competitive cost.
