By Soitec
NOVASiC: Expert in reclaiming & wafering services for high-quality, wide-bandgap materials. NOVASiC reclaim & wafering services, tailored for your needs With over 25 years of experience, NOVASiC delivers specialized wafering and reclaim services for wide-bandgap semiconductor wafers. This comprehensive offering enables NOVASiC to support diverse projects, from industrial-scale applications to precise, small-scale research initiatives. Allows prime, monitor and scrapped wafers to be returned to a process-ready state. This reduces costs as well as environmental impact. NOVASiC’s tailored SiC reclaim process - 50 - 200mm wafers - SiC or GaN epi / SiC - N-type, P-type & semi-insulating SiC substrates - Ultra-precise StepSiC polishing (0,1 nm RMS) - Standard thickness removal: 0 - 30 µm - Custom thickness removal: > 30 µm How many times can we reclaim the same wafer? Up to 10 times What thickness is removed in addition to the epitaxial layer? A minimum of 10µm is removed in addition to the epitaxial layer, in function of the initial epitaxy thickness and the quality of the thickness reporting.
