By Soitec
A patented technology enabling the transfer of ultra-thin layers from etched or partially etched CMOS wafers to other materials. Layer Transfer Technology This transfer is carried out by direct bonding of the plate at low temperature and by mechanical-chemical thinning. With extensive expertise in layer transfer, Soitec tailors solutions to customer needs: Smart Stacking™ technology adapts to wafers from 150 mm to 300 mm in diameter. It is also compatible with a wide variety of substrates including silicon, glass, ceramic (polycrystalline AlN), fused silica, and sapphire. How Smart Stacking™ Works Smart Stacking™ transfers thin layers of wafers to other substrates in a high-performance industrial environment, following these key steps: - Surface conditioning - Low-temperature molecular bonding - Wafer thinning - Edge treatment - Cleaning and metrology This process is backed by more than 20 years of experience and a strong global patent portfolio.
