- Both wet and dry processes run in a class 100 cleanroom on 100mm, 150mm, and 200mm substrates. - Anisotropic wet silicon etch in KOH and TMAH, plus isotropic wet etch for rounding and gentle removal. - Plasma dry etch for thin film and shallow silicon features. - DRIE on a 200mm capable tool for deep, high aspect ratio silicon trenches and cavities with steep, near vertical sidewalls and tight dimensional control. - Spray coat photoresist for conformal masking over high aspect ratio features, with front to back alignment for through wafer and membrane structures. - DRIE combined with spray coat and front to back alignment for complex devices such as inertial sensors.
