By Wintech Nano-Technology Services Pte. Ltd.
Ultra-high resolution 3DX-RAY microscope is a non-destructive X-ray fluoroscopy technology, combined with optical objective lens to increase magnification for experimental detection, the experimental process is to fix the object to be measured and rotate 360°, in this process to collect 2D penetration images from different angles, and then use computer computing to reconstruct the solid image of the object to be measured. It can be applied to electronic components, integrated circuit packaging, PCB circuit boards, wafer packaging, sensors, failure analysis. Full-scale mapping, connector interfaces, plastic models, automotive and aerospace parts, cables, toys, etc. Materials Science, Precision Injection Molding, Micromechanics, Electronic Geology and Biology.
