Embracing the future with maskless solutions. Just as electronic image sensors eliminated conventional camera film, spatial light modulators will ultimately replace the familiar chrome-on-glass photo masks used for decades. Maskless lithography allows for much greater flexibility compared to traditional chrome-on-plate photo masks. Unique advantages include per-die customization, improved substrate utilization and the possibility of non-periodic patterning. For applications requiring such flexibility, spatial light modulators provide a potentially great cost and time savings. Nevertheless, a key challenge persists for maskless technologies: throughput. The speed of the light modulator is crucial in achieving throughput parity with mask-based systems. The GLV®'s record-setting switching speed is well suited for this emerging market. SCREEN was an early adopter in 2011 with the DW3000 for the Advanced Package. The system can process up to 100 (200 mm) wafers per hour with 2.5 µm minimum features-resolution on a 0.5 µm resolution grid. The higher resolution system is also lined up (3 µm resolution with on a 0.5 µm grid). SCREEN has released the new system called, “LeVina” for IC package substrates in 2022. The system has been engineered for high performance & high customer value by employing 405nm laser diode with preservation of 5 µm resolution and productivity, 100 substrates (510 x 515 mm) per hour. 2 µm model with 375nm laser is also releasing for 5G, post-5G and IoT infrastructure applications. UV amplitude modulation for high throughput sub-micron resolution maskless lithography.
