By Soitec
Soitec was born from a major innovation: Smart Cut™ technology. Developed in collaboration with CEA-Leti (one of the world's leading microelectronics research laboratories), Smart Cut™ technology can be compared to an “atomic scalpel”: it makes it possible to transfer a very thin layer of material from a substrate to another. Thanks to it, it became possible to produce stacks of extremely thin (10 to 100 nm) and perfectly uniform single crystal layers of semiconductors, which could not be obtained with conventional microelectronics technologies. By assembling thin layers on the same substrate, Smart Cut™ technology makes it possible to design microelectronic equipment combining performance and energy efficiency and thus contributes to reducing their environmental footprint.
