NW
Failure Analysis & DiagnosticsCharacterization & Testing

Decap laser processing Decap laser

By Wintech Nano-Technology Services Pte. Ltd.

Project definition: red laser slotting thinning package, energy controllable, groove depth controllable, fixed-point groove for subsequent chemical opening, and Xray background image superimposed. Application advantages: It can reduce the subsequent exposure time of copper/silver wire to chemical opening, retain the electrical connection of copper wire, EFA can be done later, and the first and second solder joints of copper wire can be retained.