Achieve energy-efficient transmission at the speed of light with our silicon photonics process technologies that enable today’s pluggables and are ready for the ongoing transition of co-packaged optics (CPO). Built on a scalable, production-proven platform, our silicon photonics process technologies enable high-bandwidth, energy-efficient optical interconnects through tight integration of photonics, RF and advanced packaging to support evolving data center architectures and quantum computing. Supports all form factors: Ranging pluggable optical transceivers, including coherent and long-haul optics, retimed and linear drive pluggable optics (LPO), near packaged optics (NPO) and co-packaged optics (CPO) Extreme design flexibility: Supports custom, semi-custom and standard photonics flows, with the option for integration with our SiGe technology under one roof, enabling highly integrated designs optimized for both slow-and-wide and fast-and-narrow interface architectures OCI MSA-capable interconnect: Our SCALE™ CPO solution for slow-and-wide, scale-out applications meets and exceeds the current Optical Compute Interconnect Multi-Source Agreement (OCI MSA) requirements Flexible fiber attach: GF and ecosystem partner support for permanent, passive attach using undercut (v-grooves) and non-undercut solutions as well as detachable solutions, supporting broadband and high-power optical applications Global manufacturing: We offer 300mm and 200mm manufacturing at scale across our Malta, New York and Singapore facilities, backed by in-house packaging and test resources Advanced packaging: Solutions including TSVs, sub‑100 µm Cu pads, detachable fiber attach and support for advanced‑node EIC and on‑die lasers (in development), with U.S. onshoring planned at our Advanced Photonics & Packaging Center Malta, New York Proven to 200G/λ, clear path to 400G/λ: Bandwidth upgrades optimized for demanding data center architectures and AI/ML clusters Turnkey design enablement: Through our qualified platforms, PDKs, reference flows and a proven partner ecosystem – accelerating first-time-right design and volume production Demonstrated athermal CWDM filters: With <1dB insertion loss, <0.2dB passband ripple and <-30dB crosstalk. Reliable, low-loss optical links with reduced signal degradation for low-latency, energy-efficient interconnects. Intrinsic EMI immunity helps minimize crosstalk and preserve signal integrity (*design dependent) 8/λ and 16/λ bi-directional DWDM: We are the only 300mm silicon photonics foundry that has demonstrated 8λ and 16λ bi-directional DWDM natively on our platform, dWDM filters with 100-400GHz channel spacing are available Build on our flagship silicon photonics process technology to enable scalable data center architectures, matched to your data capacity and fiber utilization needs. Gen 1: Our widely adopted, first-generation silicon photonics process technology delivers production-proven, high-volume capability to support up to 100G/λ. By enabling flexible channel spacing (100–400GHz) and 55GHz bandwidth, this process technology is optimized to enable advanced modulation for highspeed interconnects and scalable data center networks. Gen 2: Proven up to 200G/λ with significant bandwidth upgrades (>65GHz), 200GHz channel spacing and optimizations for advanced modulation formats, our second-generation silicon photonics technology delivers double the bandwidth per wavelength to support growing data center and AI/ML architectures. Gen 3: Our next-generation silicon photonics process technology offers a clear path to 400G/λ, optimized for scale across data center architectures. Early access is now available – contact us to explore co-development opportunities with GF. Billions of connected devices and increased data center power consumption are driving the need for innovative solutions that move data faster and more efficiently than traditional copper cables. This is where silicon photonics technology is critical – enabling higher data rates, super-charging fiber-optic communication networks to fuel high-bandwidth, low-power optical interconnects for leading-edge data center products.
