At the heart of a Silicon chip is the lithography patterning. In MEMS, the challenge is often not so much about the creation of the smallest feature size, but rather the complex challenge of alignment between layers on different wafers or performing patterning on fully perforated wafers with extreme topographies. Silex has the required toolbox that innovation leaders will need to create the most advanced structures, including full-mass production capacity for laminated dry-films, the widest range of advanced polymers for production, double-sided alignment in our steppers, and spray coating in deep cavities.
