By INESC Microssistemas e Nanotecnologias
The microfabrication lithography suite is equipped with a range of advanced techniques for precise patterning and device fabrication, from fast design and exposure optimization for pattern development to exposure of pre-production batches. The techniques available comprise photo and electron beam lithography, from micrometer to nanoscale resolutions, using direct write or hard mask assisted exposure. Resist coating and development processes ensure uniform application and precise development of a varied range of resists, integral to defining micro-scale features. OUR EQUIPMENT - Laser writer Heidelberg Instruments DWLii - Electron beam system RAITH 150 - Mask aligner Karl Suss MA/BA6 - Mask aligner KLOÉ UV-KUB 2 - Resist coater & developer track SVG 88 - Semi-automated resist coater & developer SPS - Wafer washer Semitool PSC-101 Laser writer Heidelberg Instruments DWLii: Direct write lithography system from Heidelberg Instruments, utilizing a Diode laser (λ =405 nm (h-line) / write lens NA= 0.85) capable of critical dimensions down to 0.8 um. System works with mask designs in DXF format. (UPGRADE financed by FCT within the National Re-Equipment Program) Mask aligner Karl Suss MA/BA6: The SUSS MA/BA Gen4 series is a high-precision mask aligner designed for photolithography processes, offering versatile capabilities for both proximity and contact exposure modes. It supports various substrate sizes and materials, up to 200 mm wafer size, as well as different exposure wavelengths with excellent exposure uniformity. The system allows both top-side and back-side alignment.
