By Draper
Miniaturization and customization of microelectronics are enabled by advanced packaging techniques. Our team is a pioneer in the development of Three-Dimensional Heterogeneous Integration (3DHI). The use of 3DHI enables the functionality of diverse electronics to integrate into single and downscaled microelectronic packages. This technique not only allows for horizontal interconnection but also vertical stacking, significantly increasing the functionality and density enclosed in a single microelectronics package with the increasing need for specialized microelectronics, 3DHI can leverage the burgeoning chiplet ecosystem, commercial die, and existing legacy components to bring together the elements needed to meet the system’s functionality. Draper has been designing these complex components for over a decade and has dedicated onshore production facilities needed to securely manufacture these solutions. 3DHI presents unprecedented customizable microelectronics options to meet mission needs.
