microfab applies well established technologies for wafer processing and manufacturing of customer-based MEMS/microsystems, such as bulk micromachining including deep trench silicon etch DRIE, surface micromachining based on stress-controlled LPCVD layers, wafer bonding (anodic and silicon direct) or electroplating of gold and other metals and alloys. – Bulk micromachining – Advanced bulk micromachining by Deep Reactive Ion Etching DRIE (Bosch Process)Surface micromachining – based on stress-controlled poly Si and sacrificial layer etch – Surface treatment with Nanofilms Please contact us if we are allowed to introduce our standard MEMS processes to your application.
