Rogue Valley Microdevices provides precision wafer services for engineers who need individual film and process steps without committing to full device fabrication. Every wafer we process runs on the same production-grade equipment as our MEMS foundry, so the films you receive behave the same way in your process flow as they do in ours. And we never broker or outsource film processing: your wafers stay in our fab from receipt to shipment. From a single lot of development wafers to recurring production volumes, our team delivers controlled, repeatable results with fast quotes and straightforward communication. You work directly with the engineers who run your wafers, and you always know how your material is being processed. Why Choose Rogue Valley Microdevices for Wafer Services U.S.-based manufacturing All wafer services are performed at our Medford, Oregon fab, with additional capacity coming online in Palm Bay, Florida. ITAR-registered Supports defense and other export-controlled programs. In-house, end to end We never broker or outsource film processing; your wafers stay in our fab from receipt to shipment. MEMS production-line quality Wafer services run on the same tools that build our customers’ devices, ensuring process consistency and repeatability. Prototype through volume Low- to high-volume flexibility, from one-off development lots to scheduled production runs. Ready-to-ship inventory Bare silicon and pre-processed wafers in stock and ready to ship. We support MEMS development and semiconductor manufacturing workflows with a focused set of thermal and thin-film processes, each run with tight control over uniformity, repeatability, and material performance: Wafer sizes: 50.8mm, 76.2mm, 100mm, 125mm, 150mm, and 200mm substrates Substrates: Silicon, silicon-on-insulator (SOI), quartz, and sapphire; compatibility varies by process Thermal oxidation: Dry, dry chlorinated, and wet thermal oxide from 500Å to 10µm LPCVD silicon nitride: Stoichiometric, low-stress, and super-low-stress films up to 4µm LPCVD polysilicon: Undoped films with control over crystallinity, grain size, uniformity, and film stress PECVD and PVD films: Lower-temperature oxide and nitride deposition, including options for wafers with existing metal layers; metal deposition for interconnects and device functionality Production-Grade Films from a Working MEMS Fab Unlike standalone film shops and wafer resellers, we grow and deposit films inside an active MEMS foundry. Every process is qualified against the same standards we hold for full device fabrication, because the same furnaces and deposition systems build working sensors and microdevices every day. You gain: - Wafer-level uniformity and repeatable material properties, lot after lot - Films engineered for compatibility with your downstream lithography, etch, and release steps - Direct access to process engineers who can tune film thickness and stress to your device requirements - Full transparency into how your wafers are processed Flexible Engagement, from One Step to Full Fabrication Start with exactly what you need today and scale when you are ready. Because wafer services live inside our foundry, moving from film purchases to device fabrication does not mean re-qualifying with a new vendor. Your processes, and the engineers who know them, come with you. Standalone wafer processing A single film or process step on your substrates or ours. Process development and optimization For new devices and materials. Strengthen Your Supply Chain Many customers use our wafer services to build supply-chain resilience: pre-positioning coated substrates, qualifying a second U.S. source for critical films, or coordinating processing with other foundries. Our ready-to-ship inventory of bare and pre-processed wafers helps you bridge demand spikes without waiting on custom production.
