Pinpoint Defects and Root Causes Using High-Precision FIB-SEM Tools. Streamline development and quality control with Tescan’s FIB-SEM and STEM systems. Gain accurate, nanoscale insight into structures, interfaces, and defects to optimize fabrication processes and extend device performance. - Defect localization and failure analysis - Delayering and cross-sectioning - Root cause analysis - Circuit modification and nanoprototyping - TEM lamella preparation
