TAP Tool Levels Level 1 Tools Metrology & Test - Sputter Prep for SEM - Polishing Setup (SEM Cross-Section) - Thermal Microscope - Reflectance Spectrometer (Thickness Measurement) - Diff Scanning Calorimetry - Confocal Scanning Acoustic Microscope - Laser Confocal Microscope - NIR Microscope - Spectroscopic Ellipsometer - Optical Backscatter Interferometer - Optical Vector Analyzer - UV/Vis Spectrophotometer - EO Test Instruments - General Assembly - General Support Tools - Interferometer (Connected Fibers) - Fiber Prep and Fusion Splice - Die Pick and Place - Fiber Taper Manufacturing - Automated N2 Oven Wafer Processing - Film Laminator - Plasma Ash - Tape Frame Applicator 300mm - Laser Die Marker - Reflow Tool Level 2 Tools Metrology & Test - X-ray Tomography - EO Test Instruments - High Speed Assembly - Adhesive Dispenser - Large Bake Oven - High Volume Wire Bonder (requires tooling) - Mechanical Dicing Saw Wafer Processing - Laser Dicing - Single Wafer flux cleaner - Coater/Developer - Wet Metal Etch and PR strip Level 3 Tools Metrology & Test - SEM/Dual-Beam - Wafer/Die Prober (Optoelectronic test) Assembly - Laser Fiber Cleaver - Atmospheric Plasma Cleaner - Flip Chip - Semi-Automated Wire Bonder (prototype) - Chip Level Fiber Attach System - Solder Ball Jetter Wafer Processing - Plasma Dicing - Lithography Exposure - PVD/Sputtering
