Microelectronics Failure Analysis – Complete service for construction and failure analysis of semiconductor devices. Obtain accurate line widths, diffusion depths and film thicknesses using precision cross-sectioning and Scanning Electron Microscope (SEM) imaging. Common questions related to failure analysis: - What constitutes a failure? - How bad is this particular example? - What percentages of the parts are failing? - Is this a constant problem or does the failure come and go? - Have you been able to engineer a solution to the problem or failure? If so, what did you do? - Are good parts actually good or are they close to failure themselves? - Do you have an example of a truly excellent part? - Do you have an example of a truly terrible part or just the failure in hand? By combining your input, our staff, and the proper analytical techniques, we can assure you a rapid solution to your materials or process challenges.
