LPCVD, PECVD, thermal oxidation, and PVD metals — more than 50 unique dielectric and conductive films on one line. On those substrates, we offer one of the largest commercially available thin film portfolios in the industry: - Thermal oxidation (wet, dry, and dry chlorinated) from 100Å to 10µm - LPCVD silicon nitride in stoichiometric, low-stress (<250 MPa), and super-low-stress (<100 MPa) formulations - PECVD films (oxide, nitride, and oxynitride) with tunable stress and refractive index - Undoped polysilicon with control over crystallinity, grain size, and film stress - PVD metal and dielectric films by e-beam evaporation and sputtering Furnace-based thermal anneals round out the film set, including nitrogen and oxygen anneals, forming gas anneal, and PECVD oxide densification for stability through later thermal cycling.
