By Atomica
Atomica offers a variety of wet etch capabilities, where the process technologies need to be matched to the design requirements. Material removal is as vital as deposition when it comes to shaping of photonics, sensors, biotech and MEMS wafers during fabrication. Atomica ensures the highest levels of accuracy, consistency, and reliability to meet the strict performance requirements of its customers. From design to production, Atomica excels in supporting the creation of high-performance devices requiring advanced deep silicon etching and precise process management. Using state-of-the-art wet etch techniques, our engineers optimize throughput and yield for a diverse range of products, such as MEMS sensors and mirrors, photonics components, microfluidic biochips, fiber blocks, lens arrays, silicon-optical benches, and 3D interconnected devices featuring through-silicon vias (TSVs).
