14 October 2026. ASM International has introduced ASM Flowable Carbon, a PECVD Flowable Carbon film for advanced patterning in logic and memory device scaling. Kyle Campbell, Senior Manager Process Engineering, said the film is the market's first PECVD Flowable Carbon film.
The film is engineered to fill, planarize, and pattern advanced features in a single integrated process. Multi-step fill, planarization, and patterning schemes add cost, complexity, and defects, the company said.
By combining gap-fill performance with planarization, XP8® Vertos™ Flowable Carbon simplifies integration and provides topography control for advanced patterning. It can also support controlled partial-fill schemes through integrated recess processes.
In advanced logic, the material can support patterning and hard-mask schemes. In memory, including DRAM and 3D NAND, it addresses challenges with very high aspect-ratio structures. Opportunities are also being explored in advanced packaging and wafer-level integration.
Source: ASM International news
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