GF holds 2026 Technology Summit across four regions

28 October 2026. GlobalFoundries (GF) held its annual GF Technology Summit (GTS) in Silicon Valley, Shanghai, Hsinchu and Munich, bringing together customers, partners and industry leaders. More than 1,500 attendees joined this year's events. The company said the summit explored technologies shaping the next era of intelligent systems.

GF announced customer availability of its 40UX and 22UX platforms, designed to support next-generation intelligent edge and Physical AI applications spanning ultra-low-power computing, connectivity, sensing, imaging and edge AI. Alongside this, GF and RAAAM Memory Technologies announced joint development of GCRAM on the FDX platform, targeting a 40% area reduction and up to 60% lower power compared with commodity SRAM.

At GTS North America, GF debuted GFx, a GF Accelerate initiative for startups and innovators. Sponsored by Cloudberry Ventures, Playground Global and Silicon Catalyst, the track featured a panel hosted by Gregg Bartlett, CTO of GF. Presenters from Neurophos, PsiQuantum, SpiNNcloud Systems, Alif Semiconductor and Kepler Computing discussed scaling challenges for new technologies.

In Shanghai, speakers included Hong Hu, CEO of GigaDevice, and Gerald G. Wong, Founder and CEO of CIG. Yew Kong Tan, SVP and General Manager of APAC Manufacturing at GF, described how automation, digital tools and AI are applied across GF manufacturing. GF also introduced Hsinchu, Taiwan, as a new GTS location.

In Munich, Lars Reger, EVP and CTO at NXP, discussed purpose-built intelligent devices and energy efficiency. Manfred Horstmann, SVP and General Manager of European Fabs at GF, referred to SPRINT, the €1.1 billion expansion of the Dresden site. Ed Kaste, SVP of GF's CMOS business, presented an expanded FD-SOI roadmap including FDX Fusion, described as the first process technology in Europe to deliver single-digit nanometer digital performance optimized for the physical world.

GTS sessions covered FDX, FinFET, feature-rich CMOS, silicon photonics, RF, power, advanced packaging, MIPS, eNVM and design methodology. GF said the events had over 50 sponsors worldwide.

Source: GLOBALFOUNDRIES news