Henkel launches Loctite ABLESTIK CDF 900 conductive die attach film

Irvine, CA, 26 October 2026. Henkel Adhesive Technologies has launched Loctite ABLESTIK CDF 900, its next-generation conductive die attach film (cDAF) series. The material delivers thermal conductivity exceeding 8 W/m-K. It is designed to help semiconductor manufacturers address thermal and stress challenges in AI, 5G and emerging 6G telecommunications, and high-performance computing (HPC) applications.

The company said higher chip frequencies, greater thermal design power and more complex package architectures make heat dissipation and stress control critical for device performance and reliability. Loctite ABLESTIK CDF 900 combines high thermal conductivity with the precision and process consistency of a film-based die attach format.

"Henkel is a global leader in conductive die attach film, with technology widely adopted in Wi-Fi communications, automotive electronics, and power devices. Today, Loctite ABLESTIK CDF 900 pushes thermal performance to new heights while expanding applications into large-die packaging scenarios such as processors and AI chips. This offers customers broader design flexibility and superior thermal management solutions," said Kaihua Zhou, Head of Market Strategy for Semiconductor at Henkel Adhesive Technologies Electronics.

The film uses proprietary thermal filler technology to raise thermal conductivity above 8 W/m-K, Henkel said. This allows high-power components in mobile phones, processors and Wi-Fi equipment to dissipate heat and maintain stable performance. Compared with competing liquid die attach adhesives, the film format helps eliminate the risks of material bleed-out and non-uniform bondline thickness, the company said, enabling smaller, more precise die footprints within constrained spaces.

Henkel said its work on formulations for warpage and stress in large-die advanced packaging continues. It has developed high-thermal-conductivity liquid molding compounds, high-performance capillary underfills and diverse packaging material platforms. Kevin Becker, Senior Vice President of Product Development and Engineering, said, "These solutions support board-level to wafer-level packaging, low to high thermal conductivity applications, and small to large die footprints."

Source: Henkel news