9 October 2026. JEDEC has set the first silicon photonics AI network reliability standard.
The standard covers silicon photonics used in AI networks. JEDEC is the standards body named in the feed headline.
"DUV lithography involves processing silicon technologies on multiple prototyping chips with up to 200mm-sized wafers," says Emre Kaplan from Cornerstone, "and [you] can pattern them all instantly, so it's really good for scalability".
The source text does not state further details of the standard, its scope, or its publication date.
Source: Electro Optics
ZEISS has agreed to acquire Ceres Holographics, a Scottish maker of thin-film holographic optical elements for automotive windshield displays. Ceres will join ZEISS Microoptics. The price was not disclosed.
UpNano GmbH has developed 3D Adaptive Resolution (3DAR) technology, which enables dynamic control of the printing voxel in all three spatial dimensions during 2-photon polymerisation 3D printing. The first printers capable of 3DAR have been purchased by an Asian company.
Rice University researchers have extended light sheet microscopy to single-objective operation inside standard commercial sample chambers. By 3D nanoprinting noncytotoxic inserts that reflect the light sheet into the sample, the team reduced background fluorescence, photobleaching and photodamage without altering existing sample preparation workflows.
