Fine-Feature Gold Fill Using the Solstice GoldPro Reactor You will find high-speed plating in a gold sulfite bath is sensitive to localized flow vectors due to the relatively slow diffusion rate of gold complex ions. As a result, a sub-optimal electrolyte flow profile results in a non-flat plated feature shape. To overcome this issue, most immersion and fountain plating systems have to use very low plating rates. Our proprietary Solstice GoldPro reactor generates randomized fluid vectors at the diffusion layer of the wafer. This ensures that the diffusion layer is as thin as practical, and that fluid motion remains directionless. Ultimately, this results in a flat plated feature profile without sacrificing plating rate. Applications - Bond pad fill - VCSEL contact - Advanced RF applications - microLED high-resolution displays - And more... Example of fine-feature gold plating on the Solstice GoldPro reactor Features - Randomized fluid vectoring - Adjustable diffuser - Dissolved oxygen control - Dry-contact, low-maintenance plating rotor - Customized seal reach - Continuously filtered chemistry loop - Optional carbon filtration - Levitronix pump with LeviFlow Benefits - High plating rate and high uniformity - Extremely uniform field profile - Maximized bath life - Seal reach aligns to existing integration - Continuously cleaner chemistry - Precise, consistent flow rate control The single-wafer processing Solstice Platform is available with 8, 4, 3 or 2 chambers in customizable configurations, depending on the applications you require. Technical Data Wafer Sizes 75-200mm Configurable to non-standard sizes, e.g., 160mm Wafer Thickness 150μm to >6mm Wafer Materials Silicon GaAs GaN on Si, GaN on Sapphire Sapphire Transparent substrates and more Flow Rate 20 - 60 lpm Dependent on wafer size Plating Rate Up to 0.25μm/minute Dependent on chemistry and feature size Within-Wafer Uniformity <3% (range 2*mean) Wafer-to-Wafer Uniformity 1% (mean-to-mean) Step Coverage 70-93% Dependent on aspect ratio Roughness <2kÅ Fine-Feature Gold Plating Using the Solstice GoldPro Reactor The proprietary design of the Solstice GoldPro reactor is able to generate randomized fluid vectors at the diffusion layer of the wafer to optimize gold plating.
The Solstice single-wafer platform can combine multiple process technologies and chemistries in a single, small-footprint configuration for advanced chip packaging applications. VTT’s Solstice S8 system chambers will include Vacuum Prewet for high-aspect-ratio features; CopperMax™ and Copper Gen4 ECD for plating; and spin-rinse-dry (SRD) for clean, fast wafer drying post-plating. The Solstice platform’s flexible operation combines automation with manual operation, making the tool attractive for both R&D and pilot-line use, both of which VTT will use the tool to pursue. This SEM image shows a high-aspect-ratio through-silicon via (TSV) filled using a Solstice S8 CopperMax single-wafer processing system from ClassOne Technology.
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advanced single-wafer wet processing systems Configured with ClassOne's GoldPro™ electroplating chambers, the Solstice systems will be used for high-volume gold electroplating of 4-inch and 6-inch indium phosphide (InP) wafers key to next-generation optical devices for artificial intelligence (AI) data centers and other high-bandwidth communications applications. The Solstice systems deliver advanced gold plating performance to provide the throughput and process consistency required for volume InP manufacturing. These customers value the Solstice system's flexibility, which allows for metal lift-off, wet-etch and other processes to be added on the same platform. ClassOne's flagship Solstice platform is highly configurable, comprising fully automated wet processing applications with the industry's most competitive ROI.
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Solstice ® Metal Lift-Off™ Chamber Key Applications - Multi-Metal Stack Pillar Plating - Metal Lift-Off - Photoresist Strip Process Our Solstice ® metal lift-off (MLO) and solvent strip chamber is a highly capable single-wafer automated solvent chamber. The chambers contain both a high-flow, low-pressure spray for ‘soaking’ applications as well as a high-pressure, programmable swing arm for more aggressive lift-off. This chamber is also capable of polymer removal. Fresh and reclaim solvent tanks, and inline heaters, provide fast and efficient solvation and stripping of organic films from the wafer. Our Solstice MLO process has been demonstrated on features below 1 micron in width. For safety, the face-down architecture of the solvent and MLO chamber prevents operator exposure to aggressive solvents unlike open chamber solvent systems. The chamber’s annular exhaust allows for high-volume, low-velocity exhaust pull, minimizing chemistry loss during operation during operation. An integrated fire suppression system and safety system also assures you the tool meets or exceeds all life-safety standards. Before Metal Lift-Off After Metal Lift-Off Solstice® Metal Lift-Off Chamber with Face-Up SRD Chamber Overview Solstice Solvent Processing / MLO Explainer video
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ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has shipped another Solstice®CopperMax™ single-wafer processing system to a leading provider of aerospace and defense solutions. Built on ClassOne’s state-of-the-art, high-throughput Solstice platform, the system will augment the customer’s existing installed base of multiple ClassOne tools. The Solstice S8 system features the company’s proprietary CopperMax reactor, designed to deliver high-performance copper plating at a low cost of ownership. The flexible Solstice platform can perform a broad range of electroplating and surface preparation applications on a single, compact system.
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