ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has shipped another Solstice®CopperMax™ single-wafer processing system to a leading provider of aerospace and defense solutions. Built on ClassOne’s state-of-the-art, high-throughput Solstice platform, the system will augment the customer’s existing installed base of multiple ClassOne tools. The Solstice S8 system features the company’s proprietary CopperMax reactor, designed to deliver high-performance copper plating at a low cost of ownership. The flexible Solstice platform can perform a broad range of electroplating and surface preparation applications on a single, compact system.
The Solstice single-wafer platform can combine multiple process technologies and chemistries in a single, small-footprint configuration for advanced chip packaging applications. VTT’s Solstice S8 system chambers will include Vacuum Prewet for high-aspect-ratio features; CopperMax™ and Copper Gen4 ECD for plating; and spin-rinse-dry (SRD) for clean, fast wafer drying post-plating. The Solstice platform’s flexible operation combines automation with manual operation, making the tool attractive for both R&D and pilot-line use, both of which VTT will use the tool to pursue. This SEM image shows a high-aspect-ratio through-silicon via (TSV) filled using a Solstice S8 CopperMax single-wafer processing system from ClassOne Technology.
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advanced single-wafer wet processing systems Configured with ClassOne's GoldPro™ electroplating chambers, the Solstice systems will be used for high-volume gold electroplating of 4-inch and 6-inch indium phosphide (InP) wafers key to next-generation optical devices for artificial intelligence (AI) data centers and other high-bandwidth communications applications. The Solstice systems deliver advanced gold plating performance to provide the throughput and process consistency required for volume InP manufacturing. These customers value the Solstice system's flexibility, which allows for metal lift-off, wet-etch and other processes to be added on the same platform. ClassOne's flagship Solstice platform is highly configurable, comprising fully automated wet processing applications with the industry's most competitive ROI.
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Solstice ® Metal Lift-Off™ Chamber Key Applications - Multi-Metal Stack Pillar Plating - Metal Lift-Off - Photoresist Strip Process Our Solstice ® metal lift-off (MLO) and solvent strip chamber is a highly capable single-wafer automated solvent chamber. The chambers contain both a high-flow, low-pressure spray for ‘soaking’ applications as well as a high-pressure, programmable swing arm for more aggressive lift-off. This chamber is also capable of polymer removal. Fresh and reclaim solvent tanks, and inline heaters, provide fast and efficient solvation and stripping of organic films from the wafer. Our Solstice MLO process has been demonstrated on features below 1 micron in width. For safety, the face-down architecture of the solvent and MLO chamber prevents operator exposure to aggressive solvents unlike open chamber solvent systems. The chamber’s annular exhaust allows for high-volume, low-velocity exhaust pull, minimizing chemistry loss during operation during operation. An integrated fire suppression system and safety system also assures you the tool meets or exceeds all life-safety standards. Before Metal Lift-Off After Metal Lift-Off Solstice® Metal Lift-Off Chamber with Face-Up SRD Chamber Overview Solstice Solvent Processing / MLO Explainer video
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Modular Single-Wafer Processing for 200mm and 300mm Wafers The Solstice® Max platform extends ClassOne's proven single-wafer wet processing technology into a new era of modularity. Purpose-built for a broad range of wafer-level packaging (WLP) applications and fab types. Solstice Max delivers advanced electroplating and surface preparation performance with the ability to process both 200mm and 300mm wafers in the same tool. Designed from the ground up to deliver low cost of ownership (CoO), Solstice Max offers unmatched price-to-performance, process flexibility, reliability, and extraordinary modularity that grows with your production needs. Modular, Scalable Architecture The Solstice Max platform is precision-engineered to deliver process performance for today's most advanced packaging requirements with exceptional flexibility: - 200mm & 300mm capability in one platform – run silicon, glass, thinned, and bonded wafers of both sizes concurrently. - Modular, field-extendible design – start with a four-chamber system and add four-chamber modules, to a maximum of four modules (16 chambers), as production ramps. - Compact footprint – enables Solstice Max to be installed in a wide range of cleanroom environments and can accommodate fabs with height limitations. - Unbeatable ROI – achieve exceptional on-wafer results and throughput without unnecessary complexity. Multiple Processes for Expanded Possibilities Solstice Max provides a turnkey solution for electroplating, wet processing, solvent strip, and wafer cleans — allowing customers to configure unique process flows within the standard framework of the platform. Key Applications Solstice Max targets six key vital plating and wet surface process applications that encompass a host of capabilities: Advanced Packaging • High-value electroplating and support processes for advanced packaging and other back-end applications such as bumping, pillar, and multi-metal stacks. • Enabled by high-performance, fountain-style plating chamber design, together with vacuum pre-wet, wet-etch and other wet processing chambers. Seed & Barrier Etch • Fast, uniform application of seed & barrier etch chemistries enabled by the wet-etch chamber with face-up SRD. • End point detection allows for automatic recipe optimization and ongoing process validation. Solvent Processing • Dedicated or partial solvent tools can be configured with PR strip and metal liftoff (MLO) chambers, using both flood-soak and high-pressure swing arm, enabled by face-down architecture. • Stainless steel chamber design that is closed and exhausted during process, allows for safe handling and use of solvent chemistries, while minimizing escape of vapors and fumes. Back-End Cleans • Single-wafer solvent, wet-etch and bevel-etch chambers provide the full suite of options for targeted back-end cleans. • Solstice performs fast, efficient backside and front-side cleans at many steps within back-end processing to ensure wafer and packaging integrity. Advanced Gold Plating • Gold plating is the established standard for many applications, especially VCSEL and RF devices • The ECD chamber design enables rapid deposition with excellent uniformity across device types. • The Solstice Max platform's chamber flexibility is ideally suited for developing and scaling new technologies – from glass and microLEDs to hybrid bonding, heterogeneous integration, and more.
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