Compact Metrology System for R&D and laboratories Measurement and Analysis Modes: Manual / Automated Measurement Area: 148 x 148 mm² Example Use-Cases: Substrates, electronic components, wafers up to 6", other parts and components within measurement area Advanced Table-Top Metrology The CT150 is an excellent solution for R&D and failure analysis laboratories. Its adaptable design allows the integration of multiple sensors into a single system, supporting a wide range of applications. Made to Measure The CT-Series offers a uniquely versatile platform, designed to seamlessly adapt to a wide range of metrology applications. With customizable configurations tailored to your exact needs, it guarantees precise control over your products and processes. Multi-Sensor Metrology Z-Axis XY-Stage Built-In Camera Choose from six different non-contact sensor technologies for high-resolution down to 0.1 nanometer or high-speed measurements with up to 36 million datapoints per second. Add great flexibility with a combination of multiple sensors and objectives in one single system. The system includes an automated Z-axis for adjusting to different sample heights, offering autofocus functionality and a range extender to measure heights beyond the sensor's standard range. The Z-axis on the CT 150 is available in 100, 150, or 200 mm sizes. The X/Y-stage offers 148 x 148 mm² travel with 50 nm resolution for pinpoint sample positioning and lateral measurements. Optionally enhance the stage with a vacuum chuck or sample specific interfaces. Focus on what matters. The system features a built-in camera with multiple magnification options, allowing you to easily navigate on your samples or choose the sensor's scanning area in live view. Additionally, the camera enables quick and automated fiducial alignment. Available Sensors Chromatic Confocal Flexible high-speed measurements on almost any material with a z-resolution down to 3 nm. Interferometer Thickness measurement with a resolution down to 1 nm. Confocal Microscope Measure step heights or features with a z-resolution down to 1 nm. 3D White Light Interferometer With a z-resolution of down to 0.1 nm for smooth surfaces or smallest (step) heights. Reflectometer Fast and high-accurate thin film measurement down to 10 nm. Ultra high-resolution camera For precise and fast position and lateral measurements with up to 235 MP. Powerful Analysis & Automation for Production 2D/3D Analysis With over 500 surface and thickness analyses, the software is designed for a wide range of applications. Data operations Easily prepare scans and data by selecting from a broad range of operations to focus on the features that matter most to you. Automation Streamline your recurring measurements and analysis with semi-automation, providing an instant overview of results. Industry Standards Directly connect your system to production control, such as via SECS/GEM, for complete oversight of your products and processes. Application Examples The versatile design of the CT-series offers a wide range of applications in production or advanced laboratories. Heights and Critical Dimensions Coplanarity on bumps, pads, pins or connectors Roughness Options The CT 150 can be extended with various options like code readers, (customized) interfaces Calibration Targets Calibrate and certify the system anytime with ease. A wide selection of calibration targets and built-in automated procedures make the process fast and easy. Flexible Interfaces For secure sample handling, the system can be equipped with software-controlled vacuum chucks available in standard or custom designs, as well as alternative interfaces such as three-point alignment for wafers.
Resolution: down to 50 nm Speed: up to 36 million datapoints /sec Features: Interchangeable sensor heads Linesensor 2 Measuring rate: 7.9 – 18.3 kHz Light source: Laser Diodes Measurement points per line: 1200 Sensor head Measuring Range Working distance Axial Resolution Measurement angle Line length Pitch L-CHR2 600 680 µm 9.2 mm 50 nm +/- 50° 2.36 mm 1.97 µm L-CHR2 2500 2500 µm 27 mm 200 nm +/- 33° 4.40 mm 3.69 µm L-CHR2 10000 10600 µm 36.6 mm 800 nm +/- 13° 11.9 mm 9.90 µm Linesensor 2 Pro Measuring rate: 7.9 – 36 kHz Light source: Laser Diodes Measurement points per line: 1200 Sensor head Measuring Range Working distance Axial Resolution Measurement angle Line length Pitch L-CHR2 1250 Pro 1250 µm 13 mm 100 nm +/- 45° 4.50 mm 3.75 µm L-CHR2 2400 Pro 2400 µm 21.4 mm 200 nm +/- 38° 8 mm 6.67 µm L-CHR2 3000 Pro 3000 µm 40 mm 250 nm +/- 15° 20 mm 16.67 µm L-CHR2 5000 Pro 5000 µm 42 mm 400 nm +/- 25° 11.9 mm 9.92 µm
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For high-resolution lateral measurements Resolution: up to 235 MP Speed: up to 72 fps Available Models Camera Type Camera Type Color Native Resolution Maximum Resolution (Pixel Shift) Frame Rate 235M Monochrome 5120 x 5120 15360 x 15360 px 72 fps (8 fps for maximum resolution) 235C RGB 5120 x 5120 5120 x 5120 px (True Color) 72 fps (8 fps for true color mode) Objective Objecive Working Distance Magnification Field of View Aperture Lateral Resolution Xenon-Sapphire 110 mm -1.53 15 x 15 mm² 0.09 0.98 – 2.9 µm Working Principle This advanced measurement technology offers precise distance measurements using a polychromatic light source. Pixel Shifting Pixel shifting boosts resolution beyond sensor limits by capturing multiple shifted images. High Resolution The VWC-235M achieves 235 MP in black and white, while the VWC-235C captures high-resolution color by recording separate RGB values for each pixel.
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Production software for a fully automated metrology process. Management for Metrology Systems. M-Link is our software for controlling handling and multiple metrology systems. Operator-friendly and easily integrated into production environments through SECS/GEM. Key Features: Overview at a glance - Get a real-time view on handling, systems, magazines, measurements and results. Touch screen optimized - Full touch control designed for cleanroom environments. Production ready - SECS/GEM integration for seamless connection to your production environment. ASCAN remote control - Use M-Link to control ASCAN automation software, optimized for full-scale production environments.
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High-Throughput Wafer Metrology Measurement and Analysis Modes Fully Automated including Handling Measurement Area up to 2x 250 x 250 mm² single or double-sided Use-Case Examples Step Height, Flatness (Bow, Warpage), Coplanarity (Bumps, Plugs), Thin Film, Lasermarks and many more Fully Automated Metrology Cell The AL 200D integrates two dockable CT 300 or CT 350T units with a wafer handling system, supporting wafers from 4” to 8”. This design maximizes throughput and can be used for a wide range of front-end applications.
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