The OnTrak provides Market leading cleaning performance for200mm and smaller SiC substrates for post-grind, post-stock polish, post-planarizing polish, and post-CMP polish for batch and single wafer processing. Effective wafer cleaning is an essential step to prevent defects/yield loss due to contamination
Differentiated TrueFlat solder reflow equipment for processing ultra-thin substrates
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High volume solder reflow equipment used by leading OSATs and OEMs for advanced packaging of most AI semiconductor devices
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Through Entrepix, Inc. we offer double sided 200mm wafer cleaning systems used for both silicon and compound semiconductor applications. These cleaning systems are used in process steps including post-CMP clean, pre-bond clean, pre-photo clean, post-ILD deposition, and advanced packaging applications.
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Through Bruce Technologies, we manufacture and sell 200mm and 300mm horizontal diffusion and deposition furnaces, which address several steps in the semiconductor manufacturing process, including diffusion, LPCVD, high-temperature oxidation, and annealing. Bruce Technologies’ 300mm HTR furnace is a leader in HTR diffusion for power semiconductors.
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