Optimized for industrial manufacturing, ensuring high throughput and seamless production line integration The Maskless Aligner MLA 300 is designed for high-volume production, offering unmatched flexibility and precision in industrial lithography. Supporting wafers up to 315 x 315 mm², it dynamically adapts to surface variations, eliminating the need for costly and time-consuming mask production. By replacing traditional masks with direct data exposure, the MLA 300 enables innovative solutions for complex lithography challenges, such as advanced packaging, sensor calibration, and MEMS fabrication. Its high throughput, 1.5 μm resolution, simplified workflow, and seamless integration with manufacturing execution systems (MES) make it the ideal choice for diverse applications, including microfluidic devices and other advanced technologies. Key Features - High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size. - Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates. - Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems. - Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces. Applications - Advanced Packaging: Capable of fan-out wafer-level packaging with compensation for die shift and chip height variations. - Sensors and Sensor ICs: Tailored for high-precision sensor manufacturing, ensuring accurate and customizable patterning. - MEMS and Microfluidic Devices: Ideal for the complex designs required in MEMS and microfluidic applications. - Discrete Electronic Components: Supports the production of various electronic components with high precision and adaptability. - Integrated Circuits and ASICs: Optimized for efficient production of both analog and digital ICs, as well as ASICs. - Probe Cards: Enables high-precision probe card production by ensuring accurate patterning and alignment for efficient testing and inspection. - Power Electronics: Optimized for substrates such as ceramics, overcoming warpage and thickness variations to deliver consistent quality. - OLED Displays: High precision and flexibility make the MLA 300 an excellent choice for OLED display manufacturing. Workflow and Cost Efficiency - Maskless Lithography overcomes limitations of mask-based systems, offering a flexible framework for per-die pattern corrections, serialization for quality control, or calibration tracing in sensor applications. - By eliminating the need for mask procurement, verification, and management, the MLA 300 streamlines the production process, reducing both time and complexity as designs are exposed directly from data. - The MLA 300 increases yield, particularly with challenging substrate applications, such as those affected by thermal processing, thanks to its advanced capabilities. - A real-time autofocus system compensates for substrate warping or corrugations, ensuring flawless patterning even on uneven surfaces. - Operating costs are minimized by the long-lifetime diode laser, estimated to last up to 10 years in 24/7 production, and the system’s minimal consumable requirements. - Modularity allows for quick maintenance, keeping downtime to a minimum.
Designed for photomask production on large substrates in display applications Highest efficiency meets superior quality with the VPG+1400 FPD and VPG+1850 FPD, the ultimate Volume Pattern Generators for high-volume production used by photomask manufacturers around the world. They are our largest systems specifically designed for the display industry and tailored for the high-throughput patterning of large-area photomasks up to G8.6 size and a maximum exposure area of 1400 x 1800 mm². They are the optimal solution for manufacturers looking to excel in the flat panel display industry. The VPG+ 1400 FPD and VPG+ 1850 FPD are designed for high-quality and fast exposures with extremely accurate alignment. They feature a differential interferometer with a resolution down to 1.2 nm. Mura optimization ensures excellent CD uniformity and resolution, while the closed-loop environmental chamber complies with the most stringent requirements for advanced photomask fabrication. Enhance Your FPD Manufacturing - Flawless Displays: The VPG+ 1400 FPD and VPG+ 1850 FPD are optimized for the creation of high-resolution photomasks – including halftone masks – used in the production of key flat panel display (FPD) components, such as color filters (CF), thin film transistor (TFT) arrays, indium tin oxide (ITO) electrodes, touch panels (TP), fine metal masks (FMM), active-matrix organic light-emitting diodes (AMOLED), or other liquid crystal display (LCD) and organic light-emitting diode (OLED) related layers. - Outstanding Throughput: The VPG+ systems’ exceptional throughput capabilities ensure rapid mask production, allowing you to meet the demands of high-volume display manufacturing and optimize your production line. - Highest Precision & Reliability: The VPG+ 1400 FPD / VPG+ 1850 FPD deliver the precision and resolution needed for creating intricate patterns on large format masks, guaranteeing flawless transfer of your designs. They run reliably 24/7 for predictable delivery times. - Advanced Metrology: Included metrology package and tool matching functions for precise 2nd layer alignment capabilities used in large area greytone mask production. Maximize Performance - The ultra-high-speed exposure engine and high-power DPSS laser dramatically reduce writing times, enabling you to produce masks faster and maximize your production output. - The VPG+ systems boast excellent sub-µm resolution and image quality, guaranteeing the accurate transfer of your design patterns onto the photomask for flawless displays. - The automatic calibration tool streamlines your workflow by ensuring superb registration and positioning of written structures, saving you time and minimizing errors. - The large-format precision stage with flexible vacuum layout accommodates substrates up to 1850 mm, making it ideal for handling the demands of mid and large display photomasks. - The closed-loop environmental chamber maintains optimal conditions throughout the process, ensuring consistent mask quality, run after run. - The VPG+ 1400 FPD / VPG+ 1850 FPD support all industrial data formats, allowing for smooth integration with your existing design and fabrication workflows. Invest in the Future of Display Technology The VPG+ 1400 FPD and VPG+ 1850 FPD are an investment in the future of your display production capabilities. By implementing them in your production, you can achieve: - Exceptional mask quality for flawless display performance. - High throughput for high-volume display production and increased profitability. - Reduced production costs at a highly economic tool price. - Efficient tool operation and reliable performance. - Future-proof technology that scales with the demands of next-generation displays. Complement your display manufacturing with a highly economic tool. Contact us to discover how the VPG+ systems can accelerate your photomask production. Product Highlights Exposure Quality: Edge roughness 20 nm; local CD uniformity 50 nm; address grid 8 nm; Mura correction; edge detection. Writing Stability: Highly stable climate chamber, real-time climate compensations and software corrections for any environmental variations. Automated Alignment: Metrology package with automated global and field-by-field alignment with distortion correction. Sophisticated 2D correction matrix for stage position calibration and tool matching. Scalability: Scale easily for all sizes, from small and mid-size up to G8.6 display photomasks. Mura Control: Pitch and panel pitch optimization. Available Modules Photomask Handling: Semi-automatic substrate loading. Customization: Special substrates, loader, or mask handling on request.
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Following the successful introduction of the modular NanoFrazor nanolithography system in 2024, Heidelberg Instruments is proud to announce the installation of the newest NanoFrazor at EPFL. Nano High-resolution, damage-free NanoFrazor lithography enables fast and reliable fabrication of Josephson junctions for quantum and nanoelectronics applications. This application note describes the NanoFrazor’s high-resolution lift-off process for creating sub-100 nm metal features with low line edge roughness using thermal lithography. The NanoFrazor offers a unique patterning solution, combining t-SPL and laser mix and match lithography. Thermal scanning probe lithography enabled by NanoFrazor helps to fabricate devices with superior performance due to its damage-free patterning principle. Chemical conversion using a thermal scanning probe can be used to make biosensors with advanced architecture and tailor surface chemistry to create nanostructures. Explore bilayer lift-off with NanoFrazor lithography, addressing advantages, process details, and examples, including high-quality contacts and structures as small as 7 nm. High-resolution lithography is crucial for current and future technologies, requiring dimension reduction. NanoFrazor lithography, multi-layer stacks, and alternative strategies for superior patterns are discussed. The NanoFrazor combines thermal scanning probe and laser writing lithography to fabricate InSb nanowire quantum devices, achieving quasi-ballistic transport with reduced fabrication-induced disorder. Scanning probe microscopy with a NanoFrazor achieves atomic precision, enabling controlled material manipulation and high-resolution lithography, with broad applications in photonics, electronics, and nanomaterials science.
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Interactive ‘Draw Mode’ for precise electrode placement on unique flakes and heterostructures. - Advanced alignment with digital compensation for offset, rotation and scale – crucial for multi-layer quantum stacks. - Engineered for multi-user facilities with high uptime, fast onboarding (<1 hour), and accessible operation.
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Powerful production tools for standard photomasks and microstructures in i-line resists The VPG + 200, VPG + 400, and VPG + 800 Volume Pattern Generators are powerful and versatile lithography systems designed for multipurpose mask manufacturing for i-line resists. These systems excel at creating high-resolution patterns on substrates ranging from small to large formats, with capabilities to handle substrates up to 800 x 800 mm². Ideal for a wide range of applications across advanced industries, the VPG + systems are engineered to meet the evolving needs of modern microfabrication. Designed for high-quality and fast exposures with extremely accurate alignment, all VPG + models feature an interferometer with a resolution down to 10 nm. Mura optimization ensures excellent CD uniformity and resolution, while the closed-loop environmental chambers comply with the most stringent requirements for advanced photomask fabrication, ensuring consistent quality across the board. Supercharge Your Mask Production - Advanced Packaging: Ensure exceptional accuracy and speed for mask production in fan-out, interposer technology, and other cutting-edge packaging processes. The VPG + systems deliver the high-resolution output needed for high-performance masks. - Electronics Manufacturing: Seamlessly integrate the Volume Pattern Generators into your workflow for creating photomasks used in the fabrication of PCBs, ICs, and other electronic components. - Microfluidics and MEMS: Bring your microfluidic and MEMS concepts to life. The ability to create intricate patterns makes the VPG + systems perfect for mask production in these rapidly developing fields. - Smartphone Displays: Produce the most advanced smartphone photomasks with exceptional precision and speed. The VPG + systems deliver the resolution and accuracy required for high-quality LCD, LED, and OLED displays. Unmatched Performance and Efficiency - High-power DPSS Laser: Guarantees precise pattern formation, resulting in superior mask quality and enhanced device performance. - High-Speed Exposure Engine: Drastically reduces writing times, enabling faster mask production and improved throughput to meet tight deadlines. - Automatic Calibration Tool: Ensures superb registration and positioning of written structures, saving you time and minimizing errors during production. - Closed-Loop Environmental Chamber: Maintains optimal conditions for consistent mask quality in every production cycle, meeting the most demanding fabrication standards. - Wide Format Flexibility: The VPG + 800 excels on medium to large format substrates, while the VPG + 200 and VPG + 400 are tailored for small to medium formats. - Seamless Integration: All VPG + systems support industrial data formats, ensuring compatibility with your existing design and fabrication workflows. - Compact Footprint: Despite their powerful capabilities, the VPG + systems are designed to fit into facilities with limited space, offering unmatched efficiency in a compact form factor. Invest in the Future of Microfabrication The VPG + systems offer a future-proof solution for your microfabrication needs. Whether you’re focused on small, medium, or large format mask production, they provide the flexibility, precision, and speed required to advance your processes. By utilizing the VPG + systems, you can achieve: - Enhanced mask quality and resolution for superior device performance. - Increased throughput for faster mask production and reduced time-to-market. - Reduced production costs through efficient operation and reliable performance. - Scalability to meet your evolving mask-making requirements as your business grows. The VPG + 200, VPG + 400, and VPG + 800 Volume Pattern Generators are powerful and versatile lithography systems designed for multipurpose mask manufacturing for i-line resists. These systems excel at creating high-resolution patterns on substrates ranging from small to large formats, with capabilities to handle substrates up to 800 x 800 mm². Ideal for a wide range of applications across advanced industries, the VPG + systems are engineered to meet the evolving needs of modern microfabrication. Designed for high-quality and fast exposures with extremely accurate alignment, all VPG + models feature an interferometer with a resolution down to 10 nm. Mura optimization ensures excellent CD uniformity and resolution, while the closed-loop environmental chambers comply with the most stringent requirements for advanced photomask fabrication, ensuring consistent quality across the
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