By Institut Catala de Nanociencia i Nanotecnologia (ICN2)
The MultiPrep TM is a precision polishing system that enables precise semiautomatic sample polishing of a wide range of materials for microscopic (optical, SEM, FIB, TEM, AFM, etc.) evaluation. Capabilities include parallel polishing, angle polishing, site-specific polishing or any combination thereof. Dual micrometers (pitch and roll) allow precise sample tilt adjustments relative to the abrasive plane. A rigid Z-indexing spindle maintains the predefined geometric orientation throughout the grinding/polishing process. Digital indicators enable quantifiable material removal, which can be monitored real-time, or preset for unattended operation. Variable speed rotation and oscillation maximize use of the entire grinding/polishing disc and minimize artifacts. Adjustable load control expands its capability to handle a range of small (delicate) to large samples. Applications - Sample preparation equipment
The sputter coater Leica EM ACE600 is a high vacuum film deposition system that produces very thin, fine-grained and conductive metal and carbon coatings for highest resolution analysis, as required for FE-SEM and TEM applications. It can be configured for the following methods: Sputtering Pt or Au and Carbon thread evaporation. Coating thicknesses range from 2 nm to tens of nanometers.
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