Since 1985, Intersurface Dynamics has manufactured application-specific chemicals used to achieve specific surface morphologies on a variety of materials. Intersurface Dynamics’ customers include some of the world’s largest manufacturers of semiconductor devices, silicon wafers, sapphire wafers, silicon carbide wafers precision optics, ophthalmic lens, advanced displays and flat glass.
Differentiated TrueFlat solder reflow equipment for processing ultra-thin substrates
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High volume solder reflow equipment used by leading OSATs and OEMs for advanced packaging of most AI semiconductor devices
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Through Entrepix, Inc. we offer double sided 200mm wafer cleaning systems used for both silicon and compound semiconductor applications. These cleaning systems are used in process steps including post-CMP clean, pre-bond clean, pre-photo clean, post-ILD deposition, and advanced packaging applications.
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Through Bruce Technologies, we manufacture and sell 200mm and 300mm horizontal diffusion and deposition furnaces, which address several steps in the semiconductor manufacturing process, including diffusion, LPCVD, high-temperature oxidation, and annealing. Bruce Technologies’ 300mm HTR furnace is a leader in HTR diffusion for power semiconductors.
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