By Torr International Services LLC
The Torr International's MagSput™ series, the next generation Magnetron Sputtering Deposition system, is practical, inexpensive, expandable and highly reliable, ushering in the future of research. The Magnetron Sputtering System is completely customizable. The chamber can be designed to accept additional evaporation sources, and unused ports are blocked off with flanges to allow future additions. Additions can include Magnetron Guns, a Thermal Resistance source or Electron Beam Evaporation. Torr International can produce any custom system you desire. Call to discuss the functionality you require and a system will be designed to fit your process, your budget, and your future. The MagSput™ series Sputtering Systems are flexible planar magnetron sputtering systems designed specifically for R&D and prototype production. The system can be used to develop the deposition process for a variety of applications, including multi-layer optical coatings, sensor devices, solar cells, fuel cells, thin film research, superconductor research, ASICs, MEMs, magnetic devices &biomedical research. Since targets can be changed quickly, the MagSput™ series system is easily reconfigured for applications requiring a different series of deposited materials. The system processes wafers up to 12 inches in diameter and accommodates odd-size substrates. Also, because of multi-gun capability, co-sputtering, sequential sputtering without breaking vacuum and reactive sputtering (with active gas mixtures) are possible. The stand-alone guns with special mounting enable angular adjustment. The Labview™-based software brings state-of-the-art user-friendly computer control to the MagSput™ sputtering realm. The software's automatic process control ensures a more efficient deposition as well as ease of operation. The manual option enables easy start-up and troubleshooting. Specifications: - Electro Polished Stainless Steel Chamber (D shaped Box) - 4” Diameter View Port on Front Door with Manual Shutter - Single/Multiple Magnetron Gun Assemblies with Various Target Sizes - Manual Shutter Assembly for All Sources - DC / RF Sputtering Deposition - Turbo Molecular Vacuum Pumping System with Matching Dual Stage Rotary Vane Pump - Quartz Crystal Thickness Sensor with Deposition Controller - Mass Flow Controller with Digital Readout - Full Range Vacuum Gauge with Display & Readout - Easy Target Mounting - Semi-Automatic Controlled System Options: - Water Chiller - Substrate Pre-Cleaning - Load Lock Subsystem with Sample Transfer Adaptability - Multi-Axis Substrate Stage Rotation - Quartz Lamp Heater (from 300° C up to 800° C) - Planetary Substrate Stage - PLC Controlled System - PC Controlled System - Water Cooled Substrate Stage - Adjustable Size & Height Available for Substrate Stage - SQC 310 Film Thickness Monitor & Deposition Controller - Motorized Shutter Assembly - Dry Scroll Pump - Cryo Pumping System - Cold Cathode or Hot Cathode Ionization Gauge - Additional Spare Flanges for Future Upgrades
Torr International’s Compact Research Coater (model number CRC- 600) Sputtering System is a manual planar magnetron sputtering system designed for the nanotechnology research environment. This fast and affordable high-rate sputtering system provides excellent film quality in a surprisingly small footprint. The CRC-600 can be used to develop deposition processes for materials including aluminum, carbon, chromium, gold, Teflon®, silicon dioxide, tantalum, tungsten and titanium. Since the two-inch targets can be changed quickly, the CRC-600 is easily reconfigured for applications requiring a different series of deposited materials. The 150mm substrate platform and 300mm vacuum chamber accommodates wafers up to six inches in diameter, as well as irregularly shaped substrates. The CRC-600 Compact Research Coater uses a DC and RF compatible water-cooled planar magnetron source. Available options provide an expanded variety of process capabilities, including a water-cooled stage to protect extremely heat-sensitive samples such as polycarbonate membranes. The optional stage heaters can rapidly and uniformly heat a substrate to a maximum of 600°C during deposition for improved film adhesion. The CRC-600 can also be manufactured with a DC etch mode for a gentle, low-power plasma glow discharge pre-cleaning, and an RF etch option can be used for more serious etch applications for removal of bonded surface material before coating. Table Top Sputtering System (20” x 24“ Footprint) Electro-Polished Stainless Steel Chamber (D-Shaped Box) 4” Diameter View Port on Front Door with Manual Shutter Single/Multiple Magnetron Gun Assemblies with Various Target Sizes Manual Shutter Assembly for All Sources DC/RF Sputtering Deposition Turbo Molecular Vacuum Pumping Sources with Matching Dual Stage Rotary Vane Pump Quartz Crystal Thickness Sensor with Deposition Controller Mass flow controller with Digital Readout Full Range Vacuum Gauge with Digital Display & Readout Easy Target Mounting Semi-Automatic Controlled System Options: Water Chiller Substrate Pre-Cleaning Multi-Axis Substrate Stage Rotation Quartz Lamp Heater (from 300° C up to 800° C) Adjustable Size & Height Available for Substrate Stage Motorized Shutter Assembly Dry Scroll Pump Cold or Hot Cathode Ionization Gauge Adjustable Size & Height Available for Substrate Stage Additional Spare Flanges for Future Upgrades (Depending Upon Size & Number of Guns) PLC Controlled System
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Torr’s Electron Beam Deposition system is a practical and highly reliable system. The EB-4P systems have four pocket crucibles varying in volume and a variety of power sources. The E-Beam Evaporation System is completely customizable; the chamber can be designed to accept additional PVD sources. Unused ports are blocked with flanges to allow later additions. When you are ready, you can add a thermal resistance source or DC & RF sputtering or etching. Torr EB-4P systems are ideal for depositing metals, oxides, magnetic materials and dielectrics in applications such as nanotechnology, optics, microscopy, MBE, functional and decorative coatings. Our EB-4P series E-beam systems are specially tailored for laboratory or research and development, pilot production, university research or small-scale production. Their compact construction makes them ideal for clean room applications. Torr E-beam systems produce uniform, adherent thin films of many materials. E-beam evaporation produces excellent rate control deposition with low contamination and includes multiple-axis rotation capability for the best uniformity possible on any size or shape sample. - Electro-Polished Stainless Steel Chamber (D-shaped box) - 4” Diameter View Port on Front Door with Manual Shutter - Single/Multi pocket E-Beam Sources with Water Cooled Crucible (from 4cc up to 75cc) - High Voltage Power Supply (3kW to 15 kW) with X-Y Sweep Controller - Turbo Molecular Vacuum Pumping System with Matching Dual Stage - Rotary Vane Pump - Quartz Crystal Thickness Sensor with Deposition Controller - Full Range Vacuum Gauge with Digital Display and Readout - Semi-Automatic Controlled System Options: - Water Chiller - Load Lock System with Sample Transfer Adaptability - Multi-Axis Substrate Stage Rotation - Quartz Lamp Heater (from 300° C up to 800° C) - Planetary Substrate Stage - PLC Controlled System - PC Controlled System - Water Cooled Substrate Stage - SQC 310 Film Thickness Monitor & Deposition Controller - Motorized Shutter Assembly - Large Capacity Crucible & Power Supply - Dry Scroll Pump - Cryo Pumping System - Cold or Hot Cathode Ionization Gauge - Adjustable Size & Height Available for Substrate Stage - Additional Spare Flanges for Future Upgrades - Mass Flow Controller with Digital Readout - RF Cleaning Capability - In Situ Mask Changer
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Ion beam deposition (IBD) is a vacuum deposition process that uses a broad beam ion source directly focused on a sputtering target. Sputtered material from the target then deposits on a nearby substrate, creating a thin film. Some applications will use an assembly of sputter targets that can be indexed to create multilayer thin films. Most IBD applications will use a second ion source, IBAD, to control and enhance the properties of the sputtered film. Specifications: - Electro-Polished Stainless Steel Chamber (D-Shaped Box) - 4” Diameter View Port on Front Door with Manual Shutter - Turbo Molecular Vacuum Pumping System with Matching Dual Stage Rotary Vane Pump - Ion Beam Deposition with Convergent Beam Ion Source & Power Supply, with Easy Target Mounting Assembly - Ion Beam Assisted Deposition with Divergent Beam Ion Source & Power Supply - Quartz Crystal Thickness Sensor with Deposition Controller - Mass Flow Controller with Digital Readout - Full Range Vacuum Gauge with Digital Display & Readout - Semi-Automatic Controlled System Options: - Water Chiller - Load Lock System with Sample Transfer Adaptability - Multi-Axis Substrate Stage Rotation Quartz Lamp Heater (from 300° C up to 800° C) - Planetary Substrate Stage - PLC Controlled System - PC Controlled System - Water Cooled Substrate Stage - Adjustable Size & Height Available for Substrate Stage - SQC 310 Film Thickness Monitor & Deposition Controller - Motorized Shutter Assembly - Dry Scroll Pump - Cryo Pumping System - Cold Cathode or Hot Cathode Ionization Gauge - Additional Spare Flanges for Future Upgrades - RF Cleaning/Biasing Capability - In Situ Mask Changer
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The E-Beam, Thermal Evaporation & Ion Assisted System is completely customizable; Vacuum evaporation is one of the most cost-effective deposition techniques. Specifications: - Electro-Polished Stainless Steel Chamber (D-Shaped Box) - 4” Diameter View Port on Front Door with Manual Shutter - Single/Multi Pocket E-Beam Source with Water Cooled Crucible (4cc up to 75cc) with Individual Shutter - High Voltage Power Supply (3kW to 15 kW) with X-Y Sweep Controller - Turbo Molecular Vacuum Pumping System with Matching Dual Stage Rotary Vane Pump - Quartz Crystal Thickness Sensor with Deposition Controller - Full Range Vacuum Gauge with Digital Display & Readout - Two Resistive Thermal Sources with Individual Shutters - Ion Beam Assisted Deposition with Divergent Beam Ion Source & Power Supply - 115mm Substrate Stage - Semi-Automatic Controlled System Options: - Water Chiller - Load Locked System with Sample Transfer Adaptability - Multi-Axis Substrate Stage Rotation - Quartz Lamp Heater (from 300° C up to 800° C) - Planetary Substrate Stage - Motorized Shutter Assembly - PLC Controlled System - PC Controlled System - Water Cooled Substrate Stage - Adjustable Size & Height Available for Substrate Stage - SQC 310 Film Thickness Monitor & Deposition Controller - In-Situ Mask Changer - Multiple Thermal Sources, (up to four sources) with Individual Shutters - Large Capacity Crucible & Power Supply - Dry Scroll Pump - Cryo Pumping System - Cold Cathode or Hot Cathode Ionization Gauge - Additional Spare Flanges for Future Upgrades
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