High-Throughput Wafer Metrology Measurement and Analysis Modes: Fully Automated including Handling; Measurement Area up to 250 x 250 mm² single or double-sided; Measurement: Step Height, Flatness (Bow, Warpage), Coplanarity (Bumps, Plugs), Thin Film, Lasermarks and many more Fully Automated Metrology Cell: The AL 200S integrates a CT300 or CT350T unit with a wafer handling system, supporting wafers from 4” to 8”. This design maximizes throughput and can be used for a wide range of front-end applications. Technology for Throughput: The AL-Seriers combines a wide range of optical sensors technologies with handling system t Multi-Sensor Metrology XY-Stage Handling Built-In Camera For a wide range of applications in production and R&D. Choose from five optical sensor technologies for high-resolution down to 0.1 nanometer or high-speed measurements with up to 36 million datapoints per second. Add great flexibility with a combination of multiple sensors and objectives in one single system. Precise lateral movement on a measurement area of up to 250 x 250 mm². The XY stage, available for single-sided or double-sided measurements, combined with a 50 Nm encoder, ensures pinpoint accuracy for every measurement. Enabling precise positioning and detailed lateral measurements of features. Optionally extend the stage with a lift-pin vacuum chuck or customized interface. The automated wafer handling system, available with single or dual-arm configurations, can be customized with various endeffectors to suit your specific needs. It also includes wafer prealignment and cassette mapping, ensuring precise processing from the start. Precise lateral movement on a measurement area of up to 350 x 350 mm². The XY stage, available in 315 mm² or 350 mm², combined with a 50 Nm encoder, ensures pinpoint accuracy for every measurement. Enabling precise positioning and detailed lateral measurements of features. Optionally extend the stage with a vacuum chuck or interface for manual or automated loading. Available Sensors Chromatic Confocal: Flexible high-speed measurements on almost any material with a z-resolution down to 3 nm. Interferometer: Thickness measurement with a resolution down to 1 nm. Confocal Microscope: Measure step heights or features with a z-resolution down to 1 nm. 3D White Light Interferometer: With a z-resolution of down to 0.1 nm for smooth surfaces or smallest (step) heights. Reflectometer: Fast and high-accurate thin film measurement down to 10 nm. Ultra high-resolution camera: For precise and fast position and lateral measurements with up to 235 MP. Sophisticated Software: Automated Measurements & Analysis Software: Directly connect your system to production control, such as via SECS/GEM, for complete oversight of your products and processes. Manual Analysis Software: Switch to manual mode to review results and measurements using one of the 500+ individual analyses built into our software. Easy Operator Overview: Directly connect your system to production control, such as via SECS/GEM, for complete oversight of your products and processes. Application Examples: The adaptable multi-sensor metrology cell allows it to be customized to support a wide range of applications. It enables precise quality control, automated sample handling, measurement and fast analysis. Delivering reliable performance for each unique need. This flexibility makes it an ideal solution for any application demanding high-resolution metrology and operational versatility. (Step) Height and Critical Dimensions Positions, Parallelism Absolute Thickness and Variations (TTV, LTV)
Resolution: down to 50 nm Speed: up to 36 million datapoints /sec Features: Interchangeable sensor heads Linesensor 2 Measuring rate: 7.9 – 18.3 kHz Light source: Laser Diodes Measurement points per line: 1200 Sensor head Measuring Range Working distance Axial Resolution Measurement angle Line length Pitch L-CHR2 600 680 µm 9.2 mm 50 nm +/- 50° 2.36 mm 1.97 µm L-CHR2 2500 2500 µm 27 mm 200 nm +/- 33° 4.40 mm 3.69 µm L-CHR2 10000 10600 µm 36.6 mm 800 nm +/- 13° 11.9 mm 9.90 µm Linesensor 2 Pro Measuring rate: 7.9 – 36 kHz Light source: Laser Diodes Measurement points per line: 1200 Sensor head Measuring Range Working distance Axial Resolution Measurement angle Line length Pitch L-CHR2 1250 Pro 1250 µm 13 mm 100 nm +/- 45° 4.50 mm 3.75 µm L-CHR2 2400 Pro 2400 µm 21.4 mm 200 nm +/- 38° 8 mm 6.67 µm L-CHR2 3000 Pro 3000 µm 40 mm 250 nm +/- 15° 20 mm 16.67 µm L-CHR2 5000 Pro 5000 µm 42 mm 400 nm +/- 25° 11.9 mm 9.92 µm
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For high-resolution lateral measurements Resolution: up to 235 MP Speed: up to 72 fps Available Models Camera Type Camera Type Color Native Resolution Maximum Resolution (Pixel Shift) Frame Rate 235M Monochrome 5120 x 5120 15360 x 15360 px 72 fps (8 fps for maximum resolution) 235C RGB 5120 x 5120 5120 x 5120 px (True Color) 72 fps (8 fps for true color mode) Objective Objecive Working Distance Magnification Field of View Aperture Lateral Resolution Xenon-Sapphire 110 mm -1.53 15 x 15 mm² 0.09 0.98 – 2.9 µm Working Principle This advanced measurement technology offers precise distance measurements using a polychromatic light source. Pixel Shifting Pixel shifting boosts resolution beyond sensor limits by capturing multiple shifted images. High Resolution The VWC-235M achieves 235 MP in black and white, while the VWC-235C captures high-resolution color by recording separate RGB values for each pixel.
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Production software for a fully automated metrology process. Management for Metrology Systems. M-Link is our software for controlling handling and multiple metrology systems. Operator-friendly and easily integrated into production environments through SECS/GEM. Key Features: Overview at a glance - Get a real-time view on handling, systems, magazines, measurements and results. Touch screen optimized - Full touch control designed for cleanroom environments. Production ready - SECS/GEM integration for seamless connection to your production environment. ASCAN remote control - Use M-Link to control ASCAN automation software, optimized for full-scale production environments.
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High-Throughput Wafer Metrology Measurement and Analysis Modes Fully Automated including Handling Measurement Area up to 2x 250 x 250 mm² single or double-sided Use-Case Examples Step Height, Flatness (Bow, Warpage), Coplanarity (Bumps, Plugs), Thin Film, Lasermarks and many more Fully Automated Metrology Cell The AL 200D integrates two dockable CT 300 or CT 350T units with a wafer handling system, supporting wafers from 4” to 8”. This design maximizes throughput and can be used for a wide range of front-end applications.
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