Double Sided Metrology System for Production & Laboratory Modes Manual / Automated Scanning Area 329 x 329 mm² Measurement Absolut Thickness (TTV, LTV), Flatness (Bow, Warpage), Heights, Coplanarity (Bumps, Plugs), Position measurement of features of top to bottom surface and many more Double-Sided Metrology The CT350T is a cutting-edge, non-contact surface measurement system designed to precisely measure top and bottom surfaces, absolute thickness, and thickness variations simultaneously, ensuring high accuracy across all material types. Made to Measure The CT-Series offers a uniquely versatile platform, designed to seamlessly adapt to a wide range of metrology applications. With customizable configurations tailored to your exact needs, it guarantees precise control over your products and processes. Double-Sided Multi-Sensor Metrology XY-Stage Built-In Camera Measure absolute thickness, thickness variations (TTV, LTV), and top and bottom surface in a single run. With dual-sided chromatic confocal sensors, the CT350T achieves sub-micron accuracy. For high-speed applications, line sensors are available, measuring up to 1 million data points per second. The top axis can be enhanced with additional sensors, making it ideal for various production and R&D applications. Select from five advanced optical sensor technologies, offering ultra-high resolution of up to 0.1 nanometer or high-speed capable of measuring up to 1 million single points per second. Precise lateral movement on a measurement area of up to 325 x 325 mm². 50 nm encoder ensure pinpoint accuracy for every measurement. Enabling precise positioning and detailed lateral measurements of features. Optionally extend the stage with an interface for your specific samples. Focus on what matters. The system features a built-in camera with multiple magnification options, allowing you to easily navigate on your samples or choose the sensor’s scanning area in live view. Additionally, the camera enables quick and automated fiducial alignment. Available Sensors Chromatic Confocal - Flexible high-speed measurements on almost any material with a z-resolution down to 3 nm. Interferometer - Thickness measurement with a resolution down to 1 nm. Confocal Microscope - Measure step heights or features with a z-resolution down to 1 nm. 3D White Light Interferometer - With a z-resolution of down to 0.1 nm for smooth surfaces or smallest (step) heights. Reflectometer - Fast and high-accurate thin film measurement down to 10 nm. Ultra high-resolution camera - For precise and fast position and lateral measurements with up to 235 MP. Powerful Analysis & Automation for Production 2D/3D Analysis - With over 500 surface and thickness analyses, the software is designed for a wide range of applications. Data operations - Easily prepare scans and data by selecting from a broad range of operations to focus on the features that matter most to you. Automation - Streamline your recurring measurements and analysis with semi-automation, providing an instant overview of results. Industry Standards - Directly connect your system to production control, such as via SECS/GEM, for complete oversight of your products and processes. Options The modular design of the CT-series allows for seamless expansion with a variety of upgrade options. Here’s a quick glimpse of what you can add to enhance your system’s capabilities. Calibration Targets Calibrate and certify the system anytime with ease. A wide selection of calibration targets and built-in automated procedures make the process fast and easy. Flexible Interfaces To ensure secure sample fixation, the system can be equipped for seamless operation and features a fully customizable design for wafers from 4” to 12” or to meet your specific sample requirements. Configuration Example CT 350T for Wafer The CT 350T for Wafer features double-sided chromatic confocal sensors and an interface designed to easily adjust between 4 to 12-inch wafers. It enables simultaneous measurement of absolute thickness (TTV, LTV), warp and bow, all in a single operation. With predefined calibration targets, the system can automatically perform calibration whenever needed.
Resolution: down to 50 nm Speed: up to 36 million datapoints /sec Features: Interchangeable sensor heads Linesensor 2 Measuring rate: 7.9 – 18.3 kHz Light source: Laser Diodes Measurement points per line: 1200 Sensor head Measuring Range Working distance Axial Resolution Measurement angle Line length Pitch L-CHR2 600 680 µm 9.2 mm 50 nm +/- 50° 2.36 mm 1.97 µm L-CHR2 2500 2500 µm 27 mm 200 nm +/- 33° 4.40 mm 3.69 µm L-CHR2 10000 10600 µm 36.6 mm 800 nm +/- 13° 11.9 mm 9.90 µm Linesensor 2 Pro Measuring rate: 7.9 – 36 kHz Light source: Laser Diodes Measurement points per line: 1200 Sensor head Measuring Range Working distance Axial Resolution Measurement angle Line length Pitch L-CHR2 1250 Pro 1250 µm 13 mm 100 nm +/- 45° 4.50 mm 3.75 µm L-CHR2 2400 Pro 2400 µm 21.4 mm 200 nm +/- 38° 8 mm 6.67 µm L-CHR2 3000 Pro 3000 µm 40 mm 250 nm +/- 15° 20 mm 16.67 µm L-CHR2 5000 Pro 5000 µm 42 mm 400 nm +/- 25° 11.9 mm 9.92 µm
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For high-resolution lateral measurements Resolution: up to 235 MP Speed: up to 72 fps Available Models Camera Type Camera Type Color Native Resolution Maximum Resolution (Pixel Shift) Frame Rate 235M Monochrome 5120 x 5120 15360 x 15360 px 72 fps (8 fps for maximum resolution) 235C RGB 5120 x 5120 5120 x 5120 px (True Color) 72 fps (8 fps for true color mode) Objective Objecive Working Distance Magnification Field of View Aperture Lateral Resolution Xenon-Sapphire 110 mm -1.53 15 x 15 mm² 0.09 0.98 – 2.9 µm Working Principle This advanced measurement technology offers precise distance measurements using a polychromatic light source. Pixel Shifting Pixel shifting boosts resolution beyond sensor limits by capturing multiple shifted images. High Resolution The VWC-235M achieves 235 MP in black and white, while the VWC-235C captures high-resolution color by recording separate RGB values for each pixel.
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Production software for a fully automated metrology process. Management for Metrology Systems. M-Link is our software for controlling handling and multiple metrology systems. Operator-friendly and easily integrated into production environments through SECS/GEM. Key Features: Overview at a glance - Get a real-time view on handling, systems, magazines, measurements and results. Touch screen optimized - Full touch control designed for cleanroom environments. Production ready - SECS/GEM integration for seamless connection to your production environment. ASCAN remote control - Use M-Link to control ASCAN automation software, optimized for full-scale production environments.
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High-Throughput Wafer Metrology Measurement and Analysis Modes Fully Automated including Handling Measurement Area up to 2x 250 x 250 mm² single or double-sided Use-Case Examples Step Height, Flatness (Bow, Warpage), Coplanarity (Bumps, Plugs), Thin Film, Lasermarks and many more Fully Automated Metrology Cell The AL 200D integrates two dockable CT 300 or CT 350T units with a wafer handling system, supporting wafers from 4” to 8”. This design maximizes throughput and can be used for a wide range of front-end applications.
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