Resolution: down to 3 nm Speed: up to 66,000 datapoints / sec Features: Multiple sensor heads in one system Measuring rate: 10 - 66 kHz Light source: LED Sensor Head Measuring range Working distance Axial Resolution Lateral resolution* Measurement angle P-CHR-100 100 µm 1.4 mm 2 nm 1,8 µm +/- 45° P-CHR-300 300 µm 4.5 mm 3 nm 2.5 µm +/- 30° P-CHR-350 350 µm 8.4 mm 3 nm 2.5 µm +/- 20° P-CHR-400 400 µm 15 mm 3 nm 2 µm +/- 45° P-CHR-600 600 µm 6.5 mm 3 nm 2 µm +/- 30° P-CHR-1000 1000 µm 19 mm 4 nm 1.8 µm +/- 45° P-CHR-1200 1200 µm 9.3 mm 4 nm 5 µm +/- 30° P-CHR-1200 C 1200 µm 3 mm 4 nm 7.5 µm +/- 14° P-CHR-2000 LWD 2000 µm 61 mm 6 nm 6 µm +/- 15° P-CHR-2000 2000 µm 14 mm 6 nm 6 µm +/- 30° P-CHR-3000 3000 µm 23 mm 8 nm 6 µm +/- 30° P-CHR-5000 5000 µm 30 mm 12 nm 12.5 µm +/- 15° P-CHR-6000 6000 µm 53 mm 14 nm 7 µm +/- 30° P-CHR-8000 8000 µm 36 mm 18 nm 15 µm +/- 15° P-CHR-10000 10000 µm 70 mm 22 nm 12 µm +/- 20° P-CHR-12000 12000 µm 54 mm 26 nm 15 µm +/- 15° P-CHR-25000 25000 µm 77 mm 52 nm 12.5 µm +/- 15° P-CHR-38500 38500 µm 101 mm 79 nm 17 µm +/- 12° *systems offer a minium step size of 0.5 µm Interferometric Sensor Heads Sensor head Measuring range Working distance Lateral resolution Measurement Angle P-VIS-INT 3 – 180 µm 27 mm 20 µm +/- 5° P-VIS-INT C 3- 180 µm 10.6 mm 6.5 µm +/- 10° P-VIS-INT EC 3 – 180 µm 18.1 mm 25 µm +/- 5°
Resolution: down to 50 nm Speed: up to 36 million datapoints /sec Features: Interchangeable sensor heads Linesensor 2 Measuring rate: 7.9 – 18.3 kHz Light source: Laser Diodes Measurement points per line: 1200 Sensor head Measuring Range Working distance Axial Resolution Measurement angle Line length Pitch L-CHR2 600 680 µm 9.2 mm 50 nm +/- 50° 2.36 mm 1.97 µm L-CHR2 2500 2500 µm 27 mm 200 nm +/- 33° 4.40 mm 3.69 µm L-CHR2 10000 10600 µm 36.6 mm 800 nm +/- 13° 11.9 mm 9.90 µm Linesensor 2 Pro Measuring rate: 7.9 – 36 kHz Light source: Laser Diodes Measurement points per line: 1200 Sensor head Measuring Range Working distance Axial Resolution Measurement angle Line length Pitch L-CHR2 1250 Pro 1250 µm 13 mm 100 nm +/- 45° 4.50 mm 3.75 µm L-CHR2 2400 Pro 2400 µm 21.4 mm 200 nm +/- 38° 8 mm 6.67 µm L-CHR2 3000 Pro 3000 µm 40 mm 250 nm +/- 15° 20 mm 16.67 µm L-CHR2 5000 Pro 5000 µm 42 mm 400 nm +/- 25° 11.9 mm 9.92 µm
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For high-resolution lateral measurements Resolution: up to 235 MP Speed: up to 72 fps Available Models Camera Type Camera Type Color Native Resolution Maximum Resolution (Pixel Shift) Frame Rate 235M Monochrome 5120 x 5120 15360 x 15360 px 72 fps (8 fps for maximum resolution) 235C RGB 5120 x 5120 5120 x 5120 px (True Color) 72 fps (8 fps for true color mode) Objective Objecive Working Distance Magnification Field of View Aperture Lateral Resolution Xenon-Sapphire 110 mm -1.53 15 x 15 mm² 0.09 0.98 – 2.9 µm Working Principle This advanced measurement technology offers precise distance measurements using a polychromatic light source. Pixel Shifting Pixel shifting boosts resolution beyond sensor limits by capturing multiple shifted images. High Resolution The VWC-235M achieves 235 MP in black and white, while the VWC-235C captures high-resolution color by recording separate RGB values for each pixel.
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Production software for a fully automated metrology process. Management for Metrology Systems. M-Link is our software for controlling handling and multiple metrology systems. Operator-friendly and easily integrated into production environments through SECS/GEM. Key Features: Overview at a glance - Get a real-time view on handling, systems, magazines, measurements and results. Touch screen optimized - Full touch control designed for cleanroom environments. Production ready - SECS/GEM integration for seamless connection to your production environment. ASCAN remote control - Use M-Link to control ASCAN automation software, optimized for full-scale production environments.
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High-Throughput Wafer Metrology Measurement and Analysis Modes Fully Automated including Handling Measurement Area up to 2x 250 x 250 mm² single or double-sided Use-Case Examples Step Height, Flatness (Bow, Warpage), Coplanarity (Bumps, Plugs), Thin Film, Lasermarks and many more Fully Automated Metrology Cell The AL 200D integrates two dockable CT 300 or CT 350T units with a wafer handling system, supporting wafers from 4” to 8”. This design maximizes throughput and can be used for a wide range of front-end applications.
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