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Electronics
ElectronicsApplications

X-Wire Technology

By Microbonds Inc.

Microbonds developed a breakthrough nano-insulation coating on gold wires to solve a 50 year-old problem in semiconductor microchip connection (allowing more chip interconnection by enabling bonding wires to touch without short-circuit). The technology was adopted by almost all major chip companies: e.g. Intel, Motorola, Samsung, etc...

More from Microbonds Inc.

Cotton Thread Roll

SALE Request for Pricing$18 Different colours may be requested. - 100% Copper-Infused Cotton - Minimum Order of 1Kg Our thread rolls will come in a default copper colour. Disclaimer: Thread roll may appear different from image shown Product code: 388MXC5t

Polyester Thread Roll

SALE Request for Pricing$18 Different colours may be requested. - 100% Copper-Infused Polyester - Minimum order 1Kg Our thread rolls will come in a default copper colour. Disclaimer: Thread roll may appear different from image shown Product code: 389MXC5t

Nylon Thread Roll

SALE Request for Pricing$18 Different colours may be requested - 100% Copper-Infused Nylon - Minimum Order of 1Kg Our thread rolls will come in a default copper colour. Disclaimer: Thread roll may appear different from image shown Product code: 390MXC5t

ThermoPlating™

In 2008, the semiconductor market quickly switched from gold wire to palladium-electroplated-copper wire and Microbonds had to rapidly innovate a new way of plating metals, such as copper, silver & zinc, and developed a proprietary process called ThermoPlating™, which is a breakthrough technology within the metal plating industry.