By Nanovac AB
extremely compact chamber for bake-out/outgassing and advanced TVAC - perfect for CubeSats up to 16U - liquid-media or LN2 thermal control
The R&D system, PVD-2-RS is our low cost PVD system, utilizing two resistive sources for deposition.
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We also manufacture and design custom PVD (physical vapor deposition) systems for demanding thinfilm R&D applications.
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We are also manufacturing reverse engineered consumable parts for plasma etch and deposition systems.
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Horizontally loaded thermal vacuum test chambers allows for horizontal loading of the DUT (device under test). Our solutions are to a large extent custom designed, as dimensions of the DUT many times drive the size of the chambers. Inner diameters typically range from 500mm in diameter up to several meters depending on the enduser test requirements. We can deliver with hinged doors in both the front and rear of the chamber, alternatively having only one end with a door. The door can be left or right hinged, or mounted on a sliding mechanism. By default the thermal test plate is installed on a sliding rail mechanism to simplify loading/unloading and setup of the test campaign.
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