The Solstice system will be configured with ClassOne GoldPro™ chambers, specifically designed to optimize Solstice gold plating technology. Gold is highly inert to the vast majority of ink chemistries. The Solstice system’s ability to create high-quality electroplated gold films enhances inkjet printheads by delivering exceptional corrosion resistance, further ensuring durability in the presence of aggressive chemical environments. Uniformity and consistency are the hallmarks of high-performance printheads. The Solstice system’s precision plating capabilities enable uniform gold deposition, optimizing electrical conductivity for assembly consistency and reliability, while providing superior electrical interconnects for heater elements and piezoelectric actuators in chemically challenging environments. “Solstice has proven highly valuable for a host of applications that require precise, high-speed electroplating and a low cost of ownership. FUJIFILM Dimatix selecting an additional Solstice system to perform gold plating on its printheads further underscores the versatility and performance benefits of our Solstice platform.”
The Solstice single-wafer platform can combine multiple process technologies and chemistries in a single, small-footprint configuration for advanced chip packaging applications. VTT’s Solstice S8 system chambers will include Vacuum Prewet for high-aspect-ratio features; CopperMax™ and Copper Gen4 ECD for plating; and spin-rinse-dry (SRD) for clean, fast wafer drying post-plating. The Solstice platform’s flexible operation combines automation with manual operation, making the tool attractive for both R&D and pilot-line use, both of which VTT will use the tool to pursue. This SEM image shows a high-aspect-ratio through-silicon via (TSV) filled using a Solstice S8 CopperMax single-wafer processing system from ClassOne Technology.
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advanced single-wafer wet processing systems Configured with ClassOne's GoldPro™ electroplating chambers, the Solstice systems will be used for high-volume gold electroplating of 4-inch and 6-inch indium phosphide (InP) wafers key to next-generation optical devices for artificial intelligence (AI) data centers and other high-bandwidth communications applications. The Solstice systems deliver advanced gold plating performance to provide the throughput and process consistency required for volume InP manufacturing. These customers value the Solstice system's flexibility, which allows for metal lift-off, wet-etch and other processes to be added on the same platform. ClassOne's flagship Solstice platform is highly configurable, comprising fully automated wet processing applications with the industry's most competitive ROI.
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Solstice ® Metal Lift-Off™ Chamber Key Applications - Multi-Metal Stack Pillar Plating - Metal Lift-Off - Photoresist Strip Process Our Solstice ® metal lift-off (MLO) and solvent strip chamber is a highly capable single-wafer automated solvent chamber. The chambers contain both a high-flow, low-pressure spray for ‘soaking’ applications as well as a high-pressure, programmable swing arm for more aggressive lift-off. This chamber is also capable of polymer removal. Fresh and reclaim solvent tanks, and inline heaters, provide fast and efficient solvation and stripping of organic films from the wafer. Our Solstice MLO process has been demonstrated on features below 1 micron in width. For safety, the face-down architecture of the solvent and MLO chamber prevents operator exposure to aggressive solvents unlike open chamber solvent systems. The chamber’s annular exhaust allows for high-volume, low-velocity exhaust pull, minimizing chemistry loss during operation during operation. An integrated fire suppression system and safety system also assures you the tool meets or exceeds all life-safety standards. Before Metal Lift-Off After Metal Lift-Off Solstice® Metal Lift-Off Chamber with Face-Up SRD Chamber Overview Solstice Solvent Processing / MLO Explainer video
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ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has shipped another Solstice®CopperMax™ single-wafer processing system to a leading provider of aerospace and defense solutions. Built on ClassOne’s state-of-the-art, high-throughput Solstice platform, the system will augment the customer’s existing installed base of multiple ClassOne tools. The Solstice S8 system features the company’s proprietary CopperMax reactor, designed to deliver high-performance copper plating at a low cost of ownership. The flexible Solstice platform can perform a broad range of electroplating and surface preparation applications on a single, compact system.
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