By IntelliSense
IntelliEtch is an advanced ab initio based anisotropic etch process simulation tool for MEMS design and process control Atomistic Etch Simulator Atomistic etch simulation IntelliEtch is a self-contained, user-friendly, multiscale atomistic simulator of wet and DRIE etching with multi-mask patterning capabilities. Based on an octree representation of the silicon sample, it uses both Kinetic Monte Carlo (KMC) and Cellular Automata (CA) algorithms for propagating the surface forward in time. In addition to offering assistance for MEMS engineering design, IntelliEtch enables a deeper insight of key features such as the atomistic structure of any surface orientation, the step flow nature of wet etching, and the development of characteristic morphologies in the evolving etch front. Etch any surface orientation With IntelliEtch, one can pattern and etch any surface orientation (not only the traditional {100}, {110} and {111} wafers), expanding the possibilities of MEMS design and enabling the testing of vicinal surface effects. Furthermore, IntelliEtch makes possible the patterning and etching of non-flat substrates with flat, round, vertical, or diagonal features. Even spherical silicon samples can be patterned and etched. It is also possible to explore and fine-tune a particular process by etching a structure atom-by-atom. IntelliEtch at work Using advanced ab initio (first principles) based simulation techniques, IntelliEtch can simulate down to atomistic scales. Whatever your etch scale, IntelliEtch handles it with panache Easy documentation and export The simulator conveniently records modifications to each project as a separate file for easy reproduction and documentation, freeing the user from tedious bookkeeping tasks. The simulation state can be automatically saved at user-defined checkpoints, enabling the user to perform other tasks while running a simulation. After the simulation is complete, IntelliEtch offers easy integration with Finite Element Analysis software for thermal and mechanical analysis of the etched structure. Advanced etch features (a) Perform composite etches (b) Non-flat surfaces: simulate roughness and waviness effects Powerful Capabilities IntelliEtch can simulate complex MEMS structures by enabling: - the simultaneous use of multiple silicon nitride and oxide masks, applied to the top or bottom of the wafer - the definition and etching of buried insulator layers - as in SOI wafers - allowing accurate control of the etching depth in applications - the definition and etching of sacrificial layers - such as polysilicon - allowing the simulation of more complex structures Top features - Ab initio effects: First principle-based etch simulation; includes effects of steric interaction, backbond weakening, and impurity micromasking - Composite processing: Effects of multi-masking, multiple process steps - Real world usage: Predict high-order planes, surface morphology, and design corner compensations - Validated simulator: Detailed experimental backing - Validated database Database for etching based upon pioneering work of Dr. Sato at Nagoya University - Export to FEA: Direct export to IntelliSuite and other industry formats
Hexpresso is a mesh synthesis tool that allows you to generate high quality all hexahedral meshes from schematics, layouts or process flows. Enjoy Hexpresso for MEMS, Microelectronics, PCB and packaging applications! Express meshing Hexpresso brings you a blend of robust meshing combined with state-of-the-art mesh algorithms to automatically produce all hexahedral meshes in a jiffy. A powerful, yet easy to use interface allows you to tailor meshes to suit your modeling needs. Wake up and smell the coffee… Design analysts spend a significant amount of time manipulating design geometries and meshing structures. Most MEMS design tools require manually partitioning 3D geometry into mesh-able regions. Studies have shown that in a typical 10-step design through analysis cycle, a staggering 73% of time is spent in geometry manipulation and meshing Design through analysis man-hours spent (not CPU hours). A typical 10-step design through analysis cycle (excluding iterations) is shown. A staggering 73% of time is spent in geometry manipulation for meshing. [Courtesy: Matt Staten, Computing and Modeling Dept, Sandia National Labs] While many tools provide automated tetrahedral(tet) meshes they are suboptimal for MEMS design. In the words of a Sandia Labs design analyst, “The only people who use tets are those who don’t care about their answers”. Hexahedral meshes are ideal for MEMS. However, automatic generation of hex meshes for complex MEMS structures has been a big challenge … until now Top features - AutoMeshing Hexpresso takes you from process flow, schematic or layout to hex mesh in one click! - Mesh Morphing morphs the mesh to make quick changes, without having to remesh - Defeature Exclude unnecessary details (dimples, for instance) and simplify polygons before meshing - Mesh Refinement Specify areas of mesh refinement. Or in case of schematic driven meshing allow Hexpresso to automatically identify areas of high stress. - Autodetect High stress regions such as springs, beam joints, plate joints are automatically identified and refined (in schematic based meshing) - Parametric Mesh Quickly vary important device parameters such as thicknesses, gaps or sidewall angles after meshing (3D Builder required) - Transform Perform mask transformations on the fly. Translate, offset, or rotate mask information. - Tightly integrated Tightly integrated within Blueprint, IntelliFAB, and SYNPLE, Hexpresso allows FEA novices and beginners to generate high quality meshes for 3D analysis
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The TEM Module is fully coupled with IntelliSuite’s PiezoMEMS module, the most sophisticated piezoelectric and piezoresistive modeling tool in the industry. Considering piezo actuation for your MEMS device? You can investigate the voltage dependency of the natural frequency, calculate the Q factors in different packaging environments, or apply time-varying loads with ease. You can also look at a floating conductor voltage as a function of time-varying loading, an important factor in acoustic transducer and microphone design. IntelliSuite is the only tool on the market to offer fully-coupled linear and non-linear thermal-electrostatic-electromagnetic-mechanical simulations. TEM coupled with the ElectroMagnetic module can be used to simulate static and frequency responses of magnetic or electromagnetically actuated MEMS devices. Lorentz force-driven actuators such as scanning mirrors, switches, and mechanisms can be simulated wth ease. TEM is also fully coupled with IntelliSuite’s Microfluidic module. With the capability to analyze advanced fluid-structure interaction, IntelliSuite makes it easier than ever to model complex devices like piezoelectrically-actuated micropumps, fluidic damping in large micromirror arrays, and micromechanical valves.
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AnisE is an easy-to-use anisotropic etch process simulation tool for MEMS design and process control Demystifying etch behavior Anisotropic etching is one of the most difficult silicon micro-machining processes to model, often considered in the realm of the black arts. It can be challenging to grasp intuitively due to the complex nature of evolving etch fronts. In fact, many companies have developed closely guarded etch secrets through trial-and-error experimentation. Well, those days have ended. AnisE simplifies the process of accurately simulating etch behavior. Import your mask, choose your wafer orientation and your process parameters, and then watch the etching progress online before your eyes! Cellular automata Unlike other tools that utilize heuristic methods to calculate propagation of etch planes, AnisE is a cellular automata based simulation. What does this mean? That other tools fail to provide accurate results for complex masks and long etch times. With AnisE, you can choose any mask configuration, however complex, throw in double-sided etching and add etch stops. Its easy AnisE at work 3D evolution of Silicon etch profiles generated by AnisE are shown in three cases. (a) evolution of three different corner compensation schemes (b) double-sided etching of a silicon boss for an accelerometer application and (c) multi-etch of silicon, an example where DRIE is followed by an anisotropic etch. Sophisticated controls AnisE comes with built-in etch databases for KOH and TMAH. It automatically updates the etch rates as a function of temperature and concentration. With AnisE, you can simulate single or double-sided <100 and <110 etching. You can incorporate multiple etch stops, steps or anything else you can do in the real world. In addition, you can study the effect of mask misalignment, the effect of combining RIE etching with anisotropic etching and many other real- world conditions. Whether you are interested in studying process variation or designing corner compensation features, AnisE will become an invaluable part of your process toolset. Comprehensive Capabilities AnisE is capable of predicting the effects of etchant temperature, concentration, and etch time on the final 3D device geometry. Corner compensation and process tolerances can be modeled and visualized with AnisE. Creating correct geometries based on proper etch parameters before entering a fabrication facility saves resources otherwise spent on multiple prototype iterations. Top features By creating or importing a mask file, users can: - Simulate <100 or <110 wafer orientation etching - Simulate etching under different time, temperature, and concentration parameters - Access TMAH and KOH etch-rate databases, or use customized etch-rate data - Etch the top, bottom, or both sides of a wafer - Implement multiple protective etch stops - Perform multiple etchings with different masks on a single wafer - Study the effects of misalignments and other process deviations - Determine the effects of vertical etching coupled with anisotropic etching - Perform 3D geometric visualization and cross-sectioning - Take distance measurements on the etched wafer - Visualize and export 3D results in DXF and VRML formats
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IntelliFAB allows you to debug your process flow and your mask set even before you enter the clean room. It allows you to make virtual prototypes to save costly fabrication mistakes. Welcome to your virtual fab Until now, MEMS designers have typically focused purely on geometric representation of the device in order to analyze device behavior. The drawback of this methodology is that process induced effects may vary the geometry of the structure significantly. For example, the boron diffusion as an etching stop layer for bulk silicon processing may overstress the structure, strain gradients in poly-silicon structures can distort features, or an anodic bonding process may break down protective oxide films. IntelliFAB allows designers to takes a different approach. Process flow forms the basis of creating your devices. Our comprehensive process simulation modules incorporate deposition, etching, bonding, doping, electroplating, liftoff, and other process steps common in MEMS design. Other process-induced effects, such as micro-assembly, are also addressed to generate accurate geometric models for the complete range of MEMS devices. IntelliFAB is directly linked with MEMaterial, a MEMS process database that stores material properties as a function of your machine settings. By developing the fabrication process in conjunction with the analysis model, IntelliSuite enables engineers to perform more accurate device physics analysis and produce manufacturable devices faster. MEMS Process Editor A typical MEMS process flow can consist of hundreds of process steps which need to be cataloged and debugged; IntelliFAB makes editing and organizing large process tables easy. Built in grouping, filtering, and arrangement tools allow you to section, organize and debug large process tables. IntelliFAB allows you to quickly build and debug your process traveler down to the last detail. Foundry ready templates Processes can be custom-designed one step at a time, or engineers can draw from a wide range of foundry-ready process templates. Users create their own process flows from a database of over 70 process steps or by including custom process steps. Process flows can be saved as templates for repeated use. Support for popular processes MUMPS, SUMMiT-V, Infotonics (SOI Hybrid), AMIMOSIS, Bosch Surface Micromachining, LIGA, Cornell SCREAM is included out of the box Take the pain out of meshing Hexpresso, our mesh synthesis tool is now integrated with IntelliFAB. With click of a button you can create high fidelity, all-hexahedral meshes from the process flow. MEMS Designers can spend up to 70% of their design person-hours creating and manipulating meshes. Solid models created by IntelliFAB can be directly exported to analysis engines with the click of a button, saving you considerable effort and time. IntelliFAB uses true process information along with your mask layouts to create the device model for analysis. Movies Dynamic Cross Sections: View FABViewer Cross-sectioning capability in real-time. Visualize Complex Processes: Virtual prototyping of a mechanism using the Summit-V process Process Debug In Action: See how FABViewer can help you in process debug Slides View Slideshow: IntelliFAB Slideshow(Slideshare) Download PDFs: IntelliFAB Presentation PDF Wrap it up! As a packaging engineer, IntelliSense offers you tools for thermal, mechanical and high-frequency modeling of your devices. Parametric scripting capabilities allow you to effortlessly create a range of packages, such as SOICs, DIPs, QFPs etc. What's more, wafer-level encapsulation and related stress analyses may be performed with ease. As a result, you can wrap up your projects quickly and efficiently! Ace the test Working together, IntelliSuite and SYNPLE give test engineers a straightforward method for creating parametric test structures and design of experiments (DoE) during the layout process. What's more, our analysis and system simulation tools allow you to perform a vast subset of MIL-STD (750/883), JEDEC (JESD22) and Telcordia (Belcore) tests in software before the actual fabrication. For success in your next test, turn to IntelliSuite!
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