SALE Request for Pricing$18 For Sample Purposes Only - 100% Copper-Infused Silk - Size: 25cm x 25cm - Pre-washed Our swatch samples will come in a copper colour to demonstrate our process's coverage and effectiveness. Disclaimer: Fabric sample may appear different from image shown Product code: 386MXC5s
Microbonds Inc. has developed and is now commercializing a unique breakthrough technology called X-Wire™ Technology which consists of a proprietary nano-scale insulation coating material applied to bare gold and copper bonding wires that enables the development of faster, smaller and cheaper microchips while improving manufacturing reliability. Over the years the demand for smaller, more powerful and cheaper microchips constantly pushes designers and manufacturers to produce devices with higher densities and increased functionality. These densely packed devices are at electrical and physical limits where conventional wire bonds made from bare (non-insulated) bonding wires tend to touch and short-circuit causing manufacturing yield problems and restricting microchip designers from implementing further miniaturization or functionality. Over the past 20 years the microelectronic industry has concluded that many of these issues could easily be resolved if bonding wires were insulated and allowed to touch, cross and bundle without compromising product performance, cost and quality. Microbonds Inc. developed X-Wire™ Insulated Bonding Wire Technology to provide microchip designers and manufacturers with a viable and competitive solution to many of their design, manufacturing, and cost constraints.
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Copper-Infused Fabric Treatment EasyCopper incorporates our ThermoPlating™ technology by infusing and distributing copper ions into every fiber of fabric in an even manner for enhanced copper activation and cost-effectiveness. Copper provides a second line of defense against microbes in addition to routine sanitizing and good hygienic practices. COPPER-INFUSED TECHNOLOGY Benefits of Copper Infused Treatment EasyCopper Vs. Other Copper Copper Content: Through ThermoPlating™ technology, copper ions are infused deeply into fabric bundles, retaining more copper ions than other copper yarns. Bonding: EasyCopper penetrates into every sub-bundle of fabric and attaches to every strand of fiber. Application: Any fibre can be coated i.e. nylon, cotton, polyester, rezin, silk
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The dramatic rise in the market price of gold bullion has created a strong driving force within the electronics industry for the adoption of copper bonding wire as a low cost alternative to the current industry standard, gold bonding wire. Microbonds is developing coated copper wire products to extend the value proposition of insulated bonding wire as well as solving fundamental issues related to bare copper wire, such as oxidation. New coated copper bonding wire products based on X-Wire Technology are NOW AVAILABLE. Samples available by request.
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X-Wire™ Coated Gold Bonding Wire Standard and custom insulated gold bonding wire products based on X-Wire™ Technology. Coating Features - Excellent Adhesion to Au - Solvent Resistance - Flexural Strength - Thermal Stability - Environmentally Friendly - No Cracking, Flaking, Peeling - Chemically resistant to IPA - Good Bondability - No Melting, Tested 300 °C - Organic Material, RoHS Available: - Diameters down to 18 μm (0.7 mil) - Hi-voltage insulated gold bonding wire <up to 150 V - Low-voltage insulated gold bonding wire <up to 70 V
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