Through BTU International, we manufacture and sell advanced thermal processing systems used in solder reflow for SMT and advanced semiconductor packaging — including leading AI chips. BTU International is a premier brand, recognized by our customers for quality and reliability.
High volume solder reflow equipment used by leading OSATs and OEMs for advanced packaging of most AI semiconductor devices
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Through Entrepix, Inc. we offer double sided 200mm wafer cleaning systems used for both silicon and compound semiconductor applications. These cleaning systems are used in process steps including post-CMP clean, pre-bond clean, pre-photo clean, post-ILD deposition, and advanced packaging applications.
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Through Bruce Technologies, we manufacture and sell 200mm and 300mm horizontal diffusion and deposition furnaces, which address several steps in the semiconductor manufacturing process, including diffusion, LPCVD, high-temperature oxidation, and annealing. Bruce Technologies’ 300mm HTR furnace is a leader in HTR diffusion for power semiconductors.
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Through BTU International, we manufacture and sell process specific controlled atmosphere belt furnaces used for many thermal process applications such as brazing, sintering and curing. These systems serve high-volume applications primarily in the electronics and automotive (EV, HEV, and ICE) end markets and are known for their superior control of temperature and process atmosphere.
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