Our dedicated modules for substrate cleaning and drying offers state-of-the-art surface preparation capability which enables damage free cleaning…
Chuck solutions for coating: - In case the backside has active areas the use of an edge handling chuck is recommended, with an edge exclusion of typically 4mm. - Glass substrates are very sensitive to temperature gradients. Since vacuum substrate handling may cause such temperature gradients, Obducat offers glass substrate handling by corner suction cups with alignment pins Chuck solutions for developing, etching, and cleaning: - Standard wafers that are wet treated use low contact chucks, where the wafer is held in place by supporting pins. and centripetal force fixing it during the high-speed drying. - Squared substrates are held at the corners by alignment pins using low contact chucks. The advantage of this chuck is the entire backside can be rinsed. - If the backside must be protected against aggressive (etching) medias, a Bernoulli chuck can be used. This chuck blows nitrogen which protects the entire backside against chemicals. Alignment pins hold the wafer in place and enables high spin acceleration. - If alignment pins are not allowed, a venturi chuck can be used instead. Nitrogen is injected into the chuck, creating a vacuum in the chuck center by mean of an integrated Venturi nozzle, the nitrogen blows out close to the wafer backside edges. This also protects the wafer backside against chemicals. - Centrifugal chuck – Centrifugal force chucks are used for wet applications. They are held in place by supporting pins. The pins are combined with centrifugal force devices to hold the wafer down at higher spin speed.
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Neutronix is a widely recognized supplier of mask aligner and photolithography systems. The company is a full-service manufacturer, providing customers with one single source for training, equipment maintenance and parts replacement. NxQ mask aligners are designed for use in both R&D and production settings. With a range of price points and functionality to meet any need, mask aligner systems from NxQ will provide a high performance, cost-optimized solution for any need.
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Semi-automated Tool “Semi-automated Nanoimprint Lithography Tool for Large Substrates” Nanoimprint tool for substrates up to 500 x 500 mm. This semi-automated tool enables high accuracy patterns with resolutions down to 50 nm to be replicated large substrates with excellent repeatability. The system offers the highest possible flexibility using different imprint processes in the same equipment, allowing a wide range of materials to be used.
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Fully automated Nanoimprint Lithography tools A fully automated nanoimprint lithography tool suitable for high-volume manufacturing within several application areas with throughput of up to 70 WPH. Allows for imprint size up to 12” wafers. Because of its high repeatability, low maintenance cost and high yield the SINDRE® Integra tool provides a competitive Cost-of-Ownership
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