By Jan Koum Center for Nanoscience and Nanotechnology, Tel Aviv University
Manufacturer and model: DISCO DAG810 Description: The DISCO DAG810 is a high-precision, semi-automatic surface grinder designed for thinning and planarizing wafers and hard materials up to 8 inches (200 mm) in diameter. It offers outstanding thickness uniformity and surface quality for applications in semiconductor fabrication, MEMS, sensors, and 3D integration processes. With its rigid spindle design, stable grinding system, and easy-to-use control interface, the DAG810 ensures smooth, accurate, and repeatable material removal - ideal for wafer back-grinding, substrate planarization, and TSV/3DI processing. Typical applications: - Wafer thinning for MEMS and sensor devices - Planarity improvement of sapphire, SiC, or piezoelectric materials - Pre-engineered substrate preparation for chiplet and 3D integration - Precision grinding of brittle materials such as glass and ceramics
General - Multifunction PVD cluster tool - Two independent process chambers - Shared load-lock with automatic wafer transfer - 6" water-cooled substrate holder - Compatible with 4" wafer adapters and smaller samples - Fully automated PC/PLC control system with graphical HMI Available Processes - Electron Beam Evaporation - DC Magnetron Sputtering - RF Magnetron Sputtering - Reactive Sputtering - Co-Sputtering (simultaneous deposition from two targets) - Thin Film Deposition of Metals - Thin Film Deposition of Dielectrics Magnetron Sputtering Chamber - Five 3" magnetron sources - DC and RF power supplies - Confocal sputtering geometry - Reactive sputtering with Ar, N₂, and O₂ - Simultaneous co-sputtering from two sources - Cryogenic vacuum pump Electron Beam Evaporation Chamber - Electron beam source with solid-state power supply - Six 7 cc crucibles - Digital beam sweep - Automatic thickness monitoring and control - Cryogenic vacuum pump
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